XCKU3P-1FFVD900E

Field Programmable Gate Array Overview

The XCKU3P-1FFVD900E is a Kintex UltraScale+ Field Programmable Gate Array manufactured by AMD. It features 20,340 Adaptive Logic Modules and approximately 356,000 logic elements within an FCBGA-900 package. The device integrates 12.7 Mbit of embedded memory and includes 16 high-speed transceivers capable of data rates up to 16.3 Gb/s. Operating at a core voltage of 850 mV, it supports a maximum I/O count of 272 pins and functions within a commercial temperature range of 0°C to +100°C.

Field Programmable Gate Array Feature Summary

• Supports high-speed serial communication via integrated transceivers with data rates reaching 16.3 Gb/s.
• Provides substantial programmable logic density through over 20,000 adaptive logic modules for complex digital designs.
• Integrates significant on-chip memory resources including distributed RAM and embedded block RAM for data buffering.

Field Programmable Gate Array Applications

• High-performance networking infrastructure equipment
• Industrial automation control systems
• Test and measurement instrumentation

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'D' against official AMD documentation to confirm the exact speed grade and commercial temperature rating. Ensure compatibility with required PCB fabrication capabilities for the 900-ball FCBGA package. Confirm moisture sensitivity level handling procedures during assembly to prevent damage.

Field Programmable Gate Array Selection Notes

Select this component when a balance of moderate logic capacity and high-speed serial connectivity is required. Compare resource utilization against the XCKU3P-1FFVA676E if a smaller footprint is acceptable. Evaluate power consumption profiles relative to the 850 mV core voltage requirement for thermal management design.

Field Programmable Gate Array Part Context

This part belongs to the Kintex UltraScale+ family, positioned between entry-level and high-end Virtex devices. It targets applications requiring robust DSP capabilities and flexible I/O without the extreme scale of larger FPGA families. The 900-pin package offers a compact solution for dense board layouts.

Field Programmable Gate Array Replacement Considerations

Direct pin-to-pin replacements are not publicly confirmed for this specific speed grade variant. Consider the XCKU3P-1FFVA676E or XCKU3P-1FFVB676E for logical equivalence, though package differences require schematic and layout modifications.