Field Programmable Gate Array XCKU3P-3FFVB676E product image

XCKU3P-3FFVB676E

$2,320.50
  • Description:IC FPGA 280 I/O 676FCBGA
  • Series:Kintex® UltraScale+™

SKU:4afb05dd5e55 Category: Brand:

  
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XCKU3P-3FFVB676E is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 280 I/O 676FCBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for XCKU3P-3FFVB676E

  • Description:IC FPGA 280 I/O 676FCBGA
  • Series:Kintex® UltraScale+™
  • Mfr:AMD
  • Package:Tray
  • Number of LABs/CLBs:20340
  • Number of Logic Elements/Cells:355950
  • Total RAM Bits:31641600
  • Number of I/O:280
  • Voltage - Supply:0.873V ~ 0.927V
  • Mounting Type:Surface Mount
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:676-BBGA, FCBGA
  • Supplier Device Package:676-FCBGA (27x27)
  • Number of Gates:-

Field Programmable Gate Array datasheet and documents for XCKU3P-3FFVB676E

XCKU3P-3FFVB676E

Field Programmable Gate Array Overview

The XCKU3P-3FFVB676E is a Kintex UltraScale+ Field Programmable Gate Array (FPGA) manufactured by AMD. It features 20,340 Adaptive Logic Modules (ALMs) and 355,950 logic elements. The device includes 12.7 Mbit of embedded memory and supports up to 280 I/Os. It operates with a core voltage range of 0.825V to 0.876V and supports data rates up to 16.3 Gb/s via its transceivers. The component is housed in a 676-ball FCBGA package and functions within an operating temperature range of 0°C to 100°C.

Field Programmable Gate Array Feature Summary

  • Integrates high-density programmable logic resources for complex digital design implementation.
  • Supports high-speed serial communication through integrated transceiver blocks.
  • Provides flexible I/O capabilities with multiple voltage standards support.

Field Programmable Gate Array Applications

  • High-performance computing infrastructure
  • Telecommunications baseband processing
  • Industrial automation control systems

Field Programmable Gate Array Procurement Notes

Verify the specific speed grade suffix against official AMD documentation to ensure functional compatibility. Confirm moisture sensitivity level handling requirements during storage and assembly. Check for any recent product change notifications or end-of-life notices from the manufacturer before finalizing procurement plans.

Field Programmable Gate Array Selection Notes

Compare resource utilization against project requirements to ensure sufficient ALMs and memory capacity. Evaluate thermal management needs given the power consumption characteristics of the UltraScale+ architecture. Consider pinout compatibility with existing board designs when selecting this specific package variant.

Field Programmable Gate Array Part Context

This part belongs to the Kintex UltraScale+ family, which balances performance and cost for mid-to-high-end applications. It shares the same 676-ball FCBGA footprint as other variants in the series, facilitating potential design reuse across different logic density options within the same package constraint.

Field Programmable Gate Array Replacement Considerations

XCKU3P-2FFVB676E: Lower speed grade variant with identical pinout and resource count. XCKU3P-4FFVB676E: Higher speed grade variant with identical pinout and resource count. Verify timing closure requirements when substituting between speed grades.

XCKU3P-3FFVB676EXCKU3P-3FFVB676E
$2,320.50
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