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XCKU3P-3FFVB676E is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 280 I/O 676FCBGA. Review the specifications below when checking this part for your BOM.
The XCKU3P-3FFVB676E is a Kintex UltraScale+ Field Programmable Gate Array (FPGA) manufactured by AMD. It features 20,340 Adaptive Logic Modules (ALMs) and 355,950 logic elements. The device includes 12.7 Mbit of embedded memory and supports up to 280 I/Os. It operates with a core voltage range of 0.825V to 0.876V and supports data rates up to 16.3 Gb/s via its transceivers. The component is housed in a 676-ball FCBGA package and functions within an operating temperature range of 0°C to 100°C.
Verify the specific speed grade suffix against official AMD documentation to ensure functional compatibility. Confirm moisture sensitivity level handling requirements during storage and assembly. Check for any recent product change notifications or end-of-life notices from the manufacturer before finalizing procurement plans.
Compare resource utilization against project requirements to ensure sufficient ALMs and memory capacity. Evaluate thermal management needs given the power consumption characteristics of the UltraScale+ architecture. Consider pinout compatibility with existing board designs when selecting this specific package variant.
This part belongs to the Kintex UltraScale+ family, which balances performance and cost for mid-to-high-end applications. It shares the same 676-ball FCBGA footprint as other variants in the series, facilitating potential design reuse across different logic density options within the same package constraint.
XCKU3P-2FFVB676E: Lower speed grade variant with identical pinout and resource count. XCKU3P-4FFVB676E: Higher speed grade variant with identical pinout and resource count. Verify timing closure requirements when substituting between speed grades.
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