Field Programmable Gate Array XCKU3P-L1SFVB784I product image

XCKU3P-L1SFVB784I

$1,687.25
  • Description:IC FPGA 256 I/O 784FCBGA
  • Series:Kintex® UltraScale+™

SKU:a1b582135fa9 Category: Brand:

  
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XCKU3P-L1SFVB784I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 256 I/O 784FCBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for XCKU3P-L1SFVB784I

  • Description:IC FPGA 256 I/O 784FCBGA
  • Series:Kintex® UltraScale+™
  • Mfr:AMD
  • Package:Tray
  • Number of LABs/CLBs:20340
  • Number of Logic Elements/Cells:355950
  • Total RAM Bits:31641600
  • Number of I/O:256
  • Voltage - Supply:0.698V ~ 0.876V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:784-BFBGA, FCBGA
  • Supplier Device Package:784-FCBGA (23x23)
  • Number of Gates:-

Field Programmable Gate Array datasheet and documents for XCKU3P-L1SFVB784I

XCKU3P-L1SFVB784I

Field Programmable Gate Array Overview

The XCKU3P-L1SFVB784I is a Kintex UltraScale+ Field Programmable Gate Array manufactured by AMD. It features 20,340 Adaptive Logic Modules and 355,950 Logic Elements within its architecture. The device includes 12.7 Mbit of embedded memory and supports up to 304 I/O connections. It operates with a core voltage range of 850 mV to 876 mV and supports data rates up to 12.5 Gb/s via 16 transceivers. The component is housed in a 784-ball FCBGA package and functions reliably within an operating temperature range of -40°C to +100°C.

Field Programmable Gate Array Feature Summary

  • Integrates high-performance logic resources with significant embedded memory capacity for complex digital designs.
  • Supports high-speed serial communication through multiple gigabit transceivers.
  • Designed for surface-mount installation in compact electronic assemblies.

Field Programmable Gate Array Applications

  • Industrial automation control systems
  • Telecommunications infrastructure equipment
  • Test and measurement instrumentation

Field Programmable Gate Array Procurement Notes

Verify the specific suffix L1 against official AMD documentation to confirm speed grade and commercial temperature rating alignment. Confirm package type and moisture sensitivity level requirements prior to assembly planning. Ensure compatibility with existing board design constraints regarding thermal management and signal integrity for high-speed interfaces.

Field Programmable Gate Array Selection Notes

Compare resource utilization metrics such as ALM count and memory bits against project requirements to ensure adequate capacity. Evaluate transceiver availability and maximum data rate support for interface needs. Consider package dimensions and pin count relative to PCB layout limitations. Assess thermal performance characteristics under expected operational loads.

Field Programmable Gate Array Part Context

This component belongs to the Kintex UltraScale+ family, which provides a balance of performance and cost-effectiveness for mid-range applications. It shares architectural similarities with other devices in the series but offers distinct resource counts and I/O configurations tailored for specific market segments requiring reliable programmable logic solutions.

Field Programmable Gate Array Replacement Considerations

Consult AMD's official cross-reference tools or datasheets for verified compatible alternatives. Ensure any substitute part matches the required logic density, memory size, and package footprint. Verify that electrical specifications and pin assignments are compatible with the existing design without modification.

XCKU3P-L1SFVB784IXCKU3P-L1SFVB784I
$1,687.25
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