XCR3256XL-10FTG256C

Overview

The XCR3256XL-10FTG256C is a Complex Programmable Logic Device (CPLD) belonging to the CoolRunner XPLA3 series manufactured by AMD. It features 256 macrocells and approximately 6,000 usable gates within a single logic block structure. The device supports system-in-system programming with over 1,000 erase/program cycles. It operates on a single 3V to 3.6V power supply and delivers a maximum propagation delay of 9 ns, enabling a maximum clock frequency of 105 MHz. The component is housed in a 256-pin FineLine BGA package with 164 available I/O lines.

Feature Summary

• 256 Macrocells and 6,000 Gates: Provides sufficient logic density for moderate complexity digital designs within the CoolRunner XPLA3 architecture.
• High-Speed Performance: Achieves a maximum propagation delay of 9 ns and supports clock frequencies up to 105 MHz.
• System-In-System Programming: Supports non-volatile configuration with over 1,000 erase/program cycles for flexible field updates.
• Single Voltage Operation: Functions efficiently on a 3V to 3.6V supply, simplifying power design requirements.

Applications

• Interface bridging between different voltage domains or protocol converters.
• Address decoding and control logic generation in embedded systems.
• State machine implementation for industrial control applications.
• Replacement for legacy GALs or PALs in existing hardware designs.

Procurement Notes

Verify RoHS compliance status carefully, as documentation indicates potential variations between manufacturing lots or specific suffixes. Confirm the exact package marking and date code against the supplier's certificate of conformity. Ensure the source provides valid traceability records, particularly given the component's age and potential availability from secondary markets.

Selection Notes

Select this model when a low-power CPLD with moderate I/O count (164) and guaranteed 9 ns timing is required. Compare against the XCR3256XL-12 variant if slightly slower speeds are acceptable but higher volume availability is needed. Verify that the 256-FTBGA footprint matches the PCB layout constraints and that the 3V operating range aligns with the target system's power rails.

Part Context

This part belongs to the AMD (formerly Xilinx) CoolRunner XPLA3 family, designed for cost-sensitive applications requiring non-volatile programmability. It serves as a successor to older GAL technologies while offering higher density than standard SPLDs. The 'XL' designation typically indicates enhanced performance or feature sets within the baseline XPLA3 line.

Replacement Considerations

Direct pin-to-pin replacements may be limited due to EOL status. Potential alternatives include the XC2C256 series from AMD, though verification of electrical parameters and packaging compatibility is essential. Cross-vendor substitutes like Lattice LC4256V require careful review of I/O drive strengths and voltage levels.