XCR3384XL-10FG324I

XCR3384XL-10FG324I

  • Description:IC CPLD 384MC 9NS 324FBGA
  • Series:CoolRunner XPLA3

SKU:68cc308c907b Category: Brand:

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Product Detailed Parameters

  • Description:IC CPLD 384MC 9NS 324FBGA
  • Series:CoolRunner XPLA3
  • Mfr:AMD
  • Package:Tray
  • Programmable Type:In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max:9 ns
  • Voltage Supply - Internal:2.7V ~ 3.6V
  • Number of Macrocells:384
  • Number of I/O:220
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:324-BBGA
  • Supplier Device Package:324-FBGA (23x23)
  • Number of Gates:9000
  • Number of Logic Elements/Blocks:24

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XCR3384XL-10FG324I

Overview

The XCR3384XL-10FG324I is a Complex Programmable Logic Device (CPLD) from the AMD/Xilinx XCR3000XL family, housed in a 324-ball FineLine BGA package. It features 384 macrocells and supports up to 296 I/O pins. The device operates within a voltage range of 2.7 V to 3.6 V and includes EEPROM storage for non-volatile configuration. Key electrical parameters include a maximum operating frequency of 135 MHz and a typical propagation delay of 7 ns. It functions across an industrial temperature range of -40°C to +85°C.

Feature Summary

  • 384 Macrocells with 2 Logic Array Blocks (LABs)
  • Up to 296 I/O pins in a 324-ball FineLine BGA package
  • EEPROM-based non-volatile configuration memory
  • Maximum operating frequency of 135 MHz

Applications

  • High-density logic replacement
  • Address decoding and bus bridging
  • Power-on reset generation
  • Clock buffering and distribution

Procurement Notes

This component is listed as obsolete or end-of-life by the manufacturer. Verification of current stock availability through authorized distributors is required before procurement. Ensure that any sourced units are genuine and meet the specified RoHS compliance standards for the intended application environment.

Selection Notes

Select this model when a high pin count CPLD with non-volatile configuration is needed. Compare against the TQFP-144 variant (XCR3384XL-10TQG144I) if board space constraints favor a surface-mount QFP package over a BGA footprint. Verify that the 3.3V I/O levels match the target system interface requirements.

Part Context

Part of the XCR3000XL series, designed for cost-effective programmable logic solutions. This specific part number utilizes the FG324 package, offering higher I/O density compared to lower-pin-count siblings in the same logic capacity class.

Replacement Considerations

As an obsolete part, direct replacements may be limited. Consider the XCR3096XL series for increased macrocell capacity or verify compatibility with newer Xilinx Spartan or Artix families if migration is feasible.

XCR3384XL-10FG324IXCR3384XL-10FG324I

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