XCR3512XL-10FG324I

XCR3512XL-10FG324I

$302.77
  • Description:IC CPLD 512MC 9NS 324FBGA
  • Series:CoolRunner XPLA3

SKU:766fafe803ef Category: Brand:

  
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Product Detailed Parameters

  • Description:IC CPLD 512MC 9NS 324FBGA
  • Series:CoolRunner XPLA3
  • Mfr:AMD
  • Package:Bulk
  • Programmable Type:In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max:9 ns
  • Voltage Supply - Internal:2.7V ~ 3.6V
  • Number of Macrocells:512
  • Number of I/O:260
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:324-BBGA
  • Supplier Device Package:324-FBGA (23x23)
  • Number of Gates:12000
  • Number of Logic Elements/Blocks:32

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XCR3512XL-10FG324I

Overview

The XCR3512XL-10FG324I is a Complex Programmable Logic Device (CPLD) from the AMD/Xilinx XCR3000XL family. It features 512 macrocells and supports up to 288 I/O pins within an FG324 FineLine BGA package. The device operates on a single 3.3V supply with a minimum voltage of 2.7V and maximum of 3.6V. Key electrical parameters include a maximum operating frequency of 135 MHz, a typical propagation delay of 7 ns, and a maximum operating current of 30 mA. It utilizes non-volatile EEPROM technology for configuration storage.

Feature Summary

  • 512 Macrocells with 2 Logic Array Blocks (LABs)
  • EEPROM-based non-volatile configuration memory
  • FG324 FineLine BGA surface-mount package
  • Industrial temperature range (-40°C to +85°C)

Applications

  • High-density logic replacement in industrial control systems
  • Address decoding and bus bridging in embedded platforms
  • Power-on reset generation and supervisor circuits

Procurement Notes

Verify component authenticity through authorized distributors or certified secondary market suppliers. Confirm lot codes and date codes against manufacturer records. Ensure proper ESD handling procedures are followed during receipt and inspection, as CMOS devices are sensitive to electrostatic discharge.

Selection Notes

Select this model when 512 macrocells and high pin count (up to 288 I/O) are required in a compact BGA footprint. Compare against the XCR3512XL-12FT256I if a smaller FBGA-256 package with 212 I/Os is sufficient for the design constraints.

Part Context

This part belongs to the XCR3000XL series, which succeeded the original XCR3000 line. The 'XL' designation indicates enhanced performance and lower power consumption characteristics compared to earlier generations within the same architectural family.

Replacement Considerations

Direct pin-compatible replacements may be limited due to the specific FG324 package and speed grade. Evaluate the XCR3512XL-12FT256I only if the reduced I/O count (212 vs 288) and different package type (FBGA-256) are acceptable for the PCB layout.

XCR3512XL-10FG324IXCR3512XL-10FG324I
$302.77
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