XCR3512XL-10FT256C

Overview

The XCR3512XL-10FT256C is a Complex Programmable Logic Device (CPLD) from the AMD/Xilinx XCR3000XL family. It features 512 macrocells, 12,000 system gates, and 212 I/Os in an FT256 package. Operating at 2.7V to 3.6V, it delivers a maximum frequency of 135 MHz with 7 ns propagation delay. The device uses EEPROM technology for non-volatile configuration and operates within a commercial temperature range of -40°C to +85°C.

Feature Summary

• 512 Macrocells with 12,000 System Gates
• 212 General Purpose I/O Pins
• 135 MHz Maximum Operating Frequency
• EEPROM Non-Volatile Configuration Memory

Applications

• High-density logic replacement
• Address decoding and bus bridging
• Interface translation between different voltage domains

Procurement Notes

Verify component authenticity through authorized distributors. Confirm the specific suffix 'C' denotes commercial temperature grade (-40°C to +85°C). Check current availability status as older CPLD families may have limited stock or end-of-life implications.

Selection Notes

Select this model when 512 macrocells and 212 I/Os are required in a fine-pitch BGA package. Ensure the design fits within the 12,000 gate limit and meets the 7 ns timing constraints. Verify that the 2.7V-3.6V supply range aligns with the target system power architecture.

Part Context

This part belongs to the XCR3000XL series, which succeeded the original XCR3000 line. It offers higher density and improved performance while maintaining compatibility with legacy Xilinx design tools. The FT256 package provides a compact solution for high-pin-count applications.

Replacement Considerations

Direct pin-to-pin replacements include other variants in the XCR3512XL family with different speed grades or temperature ranges, such as XCR3512XL-10FG324I for larger packages. Cross-family migration to XC9500XL requires schematic redesign due to architectural differences.