SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The XCR3512XL-10FTG256I is a Complex Programmable Logic Device (CPLD) from the XCR3512XL series, manufactured by AMD/Xilinx. It features 512 macrocells and 212 I/Os housed in a 256-pin FineLine BGA package. The device operates on a single 2.7V to 3.6V supply with EEPROM-based non-volatile configuration storage. Key electrical parameters include a maximum operating frequency of 135 MHz, a typical propagation delay of 7 ns, and an industrial temperature range of -40°C to +85°C. The architecture utilizes two Logic Array Blocks (LABs) and supports up to 12,000 system gates.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm the specific suffix 'FTG' denotes the FineLine BGA package variant. Check for end-of-life status or discontinuation notices, as older CPLD families may have limited availability. Ensure ESD handling protocols are followed during procurement and storage.
Select this model when 512 macrocells and over 200 I/Os are required in a compact BGA footprint. Compare against the XCR3512XL-12 variant if higher speed (12 ns vs 10 ns implied by suffix, though datasheet specifies 7ns/135MHz generally) or different packaging is needed. Verify voltage compatibility with 3.3V or 2.5V I/O standards. Consider pin count constraints relative to the 256-ball grid array.
This part belongs to the Xilinx CoolRunner-II XL family, designed for cost-sensitive, high-performance CPLD applications. It succeeds earlier CoolRunner-II devices with increased density and improved power efficiency. The XCR3512XL series is widely used in telecommunications, networking, and consumer electronics where reliable, non-volatile programmable logic is essential.
Direct pin-to-pin replacements within the same family include the XCR3512XL-10FT256I (different package) or XCR3512XL-12FTG256I (higher speed grade). Cross-family upgrades may require schematic and layout modifications due to differing I/O structures and pinouts.