XCR3512XL-10FTG256I

XCR3512XL-10FTG256I

$272.94
  • Description:IC CPLD 512MC 9NS 256FTBGA
  • Series:CoolRunner XPLA3

SKU:55ecface4e77 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:IC CPLD 512MC 9NS 256FTBGA
  • Series:CoolRunner XPLA3
  • Mfr:AMD
  • Package:Tray
  • Programmable Type:In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max:9 ns
  • Voltage Supply - Internal:2.7V ~ 3.6V
  • Number of Macrocells:512
  • Number of I/O:212
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FTBGA (17x17)
  • Number of Gates:12000
  • Number of Logic Elements/Blocks:32

Download product information

XCR3512XL-10FTG256I

Overview

The XCR3512XL-10FTG256I is a Complex Programmable Logic Device (CPLD) from the XCR3512XL series, manufactured by AMD/Xilinx. It features 512 macrocells and 212 I/Os housed in a 256-pin FineLine BGA package. The device operates on a single 2.7V to 3.6V supply with EEPROM-based non-volatile configuration storage. Key electrical parameters include a maximum operating frequency of 135 MHz, a typical propagation delay of 7 ns, and an industrial temperature range of -40°C to +85°C. The architecture utilizes two Logic Array Blocks (LABs) and supports up to 12,000 system gates.

Feature Summary

  • 512 Macrocells with 212 I/Os for high-density logic implementation
  • EEPROM non-volatile configuration memory for instant-on operation
  • Industrial temperature range (-40°C to +85°C) for robust environmental performance
  • High-speed performance with 135 MHz max frequency and 7 ns propagation delay

Applications

  • High-density interface bridging between processors and peripherals
  • Address decoding and bus arbitration in embedded systems
  • State machine control for industrial automation equipment
  • Power-on reset generation and configuration management

Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm the specific suffix 'FTG' denotes the FineLine BGA package variant. Check for end-of-life status or discontinuation notices, as older CPLD families may have limited availability. Ensure ESD handling protocols are followed during procurement and storage.

Selection Notes

Select this model when 512 macrocells and over 200 I/Os are required in a compact BGA footprint. Compare against the XCR3512XL-12 variant if higher speed (12 ns vs 10 ns implied by suffix, though datasheet specifies 7ns/135MHz generally) or different packaging is needed. Verify voltage compatibility with 3.3V or 2.5V I/O standards. Consider pin count constraints relative to the 256-ball grid array.

Part Context

This part belongs to the Xilinx CoolRunner-II XL family, designed for cost-sensitive, high-performance CPLD applications. It succeeds earlier CoolRunner-II devices with increased density and improved power efficiency. The XCR3512XL series is widely used in telecommunications, networking, and consumer electronics where reliable, non-volatile programmable logic is essential.

Replacement Considerations

Direct pin-to-pin replacements within the same family include the XCR3512XL-10FT256I (different package) or XCR3512XL-12FTG256I (higher speed grade). Cross-family upgrades may require schematic and layout modifications due to differing I/O structures and pinouts.

XCR3512XL-10FTG256IXCR3512XL-10FTG256I
$272.94
Buy Now