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The XCR3512XL-12FT256I is a Complex Programmable Logic Device (CPLD) from the XCR3512XL series, manufactured by AMD/Xilinx. It features 512 macrocells and 212 I/Os within an FBGA-256 package. The device operates on a 2.7 V to 3.6 V supply voltage with a maximum frequency of 135 MHz and a propagation delay of 7 ns. It utilizes EEPROM storage technology and supports industrial temperature ranges from -40°C to +85°C. This component is designed for surface-mount installation and contains approximately 12,000 gates across two logic array blocks.
This component is officially listed as End-of-Life (EOL). Discontinuation notifications are dated January 1, 2024. Availability is restricted or unavailable through standard distribution channels. Verification of current stock status requires direct inquiry with authorized suppliers or distributors, as market availability varies significantly due to the EOL status.
Select this part for applications requiring 512 macrocells and 212 I/Os in an FBGA-256 package. Ensure design compatibility with the 2.7 V to 3.6 V operating voltage range. Verify that the -40°C to +85°C industrial temperature rating meets environmental requirements. Consider the EOL status when planning long-term production lifecycles.
The XCR3512XL-12FT256I belongs to the XCR3512XL family of CPLDs. It shares architectural similarities with other members like the XCR3256XL-12FT256C but offers higher resource density with 512 macrocells compared to lower-end variants. The 'I' suffix denotes the industrial temperature grade (-40°C to +85°C), distinguishing it from commercial grade options.
Due to the End-of-Life status, direct substitutes may be limited. Evaluate newer Xilinx/AMD CPLD families such as the XC9500XL or Spartan/FPGA alternatives based on pin count and logic resource requirements. Cross-reference pinouts and electrical specifications carefully before transitioning to alternative components.