Field Programmable Gate Array XCV200-5BG352I product image

XCV200-5BG352I

  • Description:IC FPGA 260 I/O 352MBGA
  • Series:Virtex®

SKU:882b9f116c3c Category: Brand:

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XCV200-5BG352I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 260 I/O 352MBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for XCV200-5BG352I

  • Description:IC FPGA 260 I/O 352MBGA
  • Series:Virtex®
  • Mfr:AMD
  • Package:Tray
  • Number of LABs/CLBs:1176
  • Number of Logic Elements/Cells:5292
  • Total RAM Bits:57344
  • Number of I/O:260
  • Voltage - Supply:2.375V ~ 2.625V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:352-LBGA Exposed Pad, Metal
  • Supplier Device Package:352-MBGA (35x35)
  • Number of Gates:236666

Field Programmable Gate Array datasheet and documents for XCV200-5BG352I

XCV200-5BG352I

Field Programmable Gate Array Overview

The XCV200-5BG352I is a Virtex FPGA manufactured by AMD, utilizing a 0.22 μm CMOS process. It features 236,666 system gates and 5,292 logic cells within a 28x42 CLB array. The device supports up to 284 available I/O pins and includes 57,344 Block RAM bits. Operating at speed grade -5, it accommodates supply voltages between 2.375V and 2.625V. It is housed in a 352-pin LBGA package with an exposed metal pad and operates within a commercial temperature range of 0°C to +85°C.

Field Programmable Gate Array Feature Summary

  • SRAM-based architecture enabling unlimited re-programmability via four configuration modes
  • Integrated SelectRAM memory hierarchy supporting distributed LUTs and dual-ported block RAM
  • VersaRing I/O interface providing enhanced routability and pin-locking capabilities
  • Four dedicated delay-locked loops for advanced clock domain control

Field Programmable Gate Array Applications

  • High-performance digital signal processing systems
  • Complex state machine implementations requiring high gate density
  • Prototyping designs targeting mask-programmed gate arrays

Field Programmable Gate Array Procurement Notes

Verify component authenticity through authorized channels as this part is obsolete. Confirm RoHS non-compliance status due to lead content. Ensure proper handling procedures are followed given the Moisture Sensitivity Level 3 classification. Validate that the specific ordering suffix matches the required industrial temperature range and package variant.

Field Programmable Gate Array Selection Notes

Select this model when design requirements exceed Spartan capabilities but do not necessitate larger Virtex devices. Verify that the 352-pin BG352 package fits the target PCB footprint. Ensure power delivery circuits support the specified 2.5V core voltage range. Check compatibility with existing development tools for the Virtex family.

Field Programmable Gate Array Part Context

This component belongs to the original Virtex family released on a 0.22 μm process. It serves as a mid-range option within the series, offering higher capacity than the XCV150 while maintaining a smaller footprint than the XCV300. The device represents an early generation of high-density FPGAs before the introduction of Virtex-E or Virtex-II technologies.

Field Programmable Gate Array Replacement Considerations

Public confirmed substitute part numbers: None.

XCV200-5BG352IXCV200-5BG352I

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