Field Programmable Gate Array XCV200E-7FG256I product image

XCV200E-7FG256I

  • Description:IC FPGA 176 I/O 256FBGA
  • Series:Virtex®-E

SKU:5fe66eb85d4e Category: Brand:

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XCV200E-7FG256I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 176 I/O 256FBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for XCV200E-7FG256I

  • Description:IC FPGA 176 I/O 256FBGA
  • Series:Virtex®-E
  • Mfr:AMD
  • Package:Tray
  • Number of LABs/CLBs:1176
  • Number of Logic Elements/Cells:5292
  • Total RAM Bits:114688
  • Number of I/O:176
  • Voltage - Supply:1.71V ~ 1.89V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:256-BGA
  • Supplier Device Package:256-FBGA (17x17)
  • Number of Gates:306393

Field Programmable Gate Array datasheet and documents for XCV200E-7FG256I

XCV200E-7FG256I

Field Programmable Gate Array Overview

The XCV200E-7FG256I is a Virtex-E Field Programmable Gate Array manufactured by Xilinx, now AMD. It utilizes a 0.18 μm CMOS process with a 1.8 V core voltage and operates within an industrial temperature range of -40°C to +100°C. The device features 306,393 system gates, 63,504 logic gates, and a 28 x 42 array of 5,292 logic cells. It includes 114,688 bits of BlockRAM and 75,264 bits of distributed RAM. Implemented in a 256-pin Fine Pitch Ball Grid Array (FG256) package, it supports up to 176 user I/Os and delivers internal performance at 130 MHz across four LUT levels.

Field Programmable Gate Array Feature Summary

  • Supports high-speed source-synchronous data transmission architectures achieving up to 622 Mb/s.
  • Features eight fully digital Delay-Locked Loops for clock distribution delay compensation and domain control.
  • Provides True Dual-Port BlockRAM capability with memory bandwidth up to 1.66 Tb/s.
  • Includes dedicated carry logic and multiplier support optimized for high-speed arithmetic functions.

Field Programmable Gate Array Applications

  • PCI compliant 3.3 V, 32/64-bit, 33/66-MHz interface implementations
  • High-performance interfaces to external 200 MHz ZBT SRAMs
  • Interfaces to 200 Mb/s DDR SDRAMs

Field Programmable Gate Array Procurement Notes

Verify the component authenticity through official manufacturer channels or authorized distributors. Confirm that the specific ordering suffix matches the required speed grade (-7), package type (FG256), and industrial temperature rating (I). Ensure compatibility with existing design constraints regarding the 1.8 V core voltage and 3.3 V I/O standards before finalizing procurement.

Field Programmable Gate Array Selection Notes

Select this model when designs require approximately 300k system gates with high-density memory resources. The FG256 package offers a balance between pin count and board space. Consider the 1.8 V core voltage requirements for power management and ensure the PCB layout accommodates the specific banking rules for mixed-voltage I/O standards supported by the Virtex-E architecture.

Field Programmable Gate Array Part Context

This component belongs to the Virtex-E family, representing an evolutionary step from the original Virtex series. It introduces a 0.18 μm process and 1.8 V operation, resulting in higher density and lower power consumption compared to its predecessors. While not bitstream-compatible with the original Virtex family, it maintains pin compatibility for many packages, facilitating migration for existing designs requiring enhanced performance.

Field Programmable Gate Array Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Designs migrating from the standard Virtex family should verify pinout exceptions and recompile bitstreams, as the families are not bitstream-compatible despite potential physical pin similarities.

XCV200E-7FG256IXCV200E-7FG256I

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