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XCV50-6BG256C is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 180 I/O 256BGA. Review the specifications below when checking this part for your BOM.
The AMD XCV50-6BG256C is a field-programmable gate array (FPGA) belonging to the Spartan-3E product family. It utilizes a 90 nm low-k process technology and features 4,972,800 system gates with 144 kilobits of embedded block RAM. The device includes 128 user I/O pins and supports multiple supply voltages including 1.2V, 1.5V, and 2.5V. It operates within an industrial temperature range of -40°C to +85°C and is housed in a 256-ball ball grid array (BGA) package.
Verify component authenticity through authorized distributors or certified secondary market suppliers. Check for date codes and lot traceability to ensure compliance with RoHS directives. Inspect packaging integrity to prevent moisture sensitivity issues prior to reflow soldering processes.
Compare against newer Spartan-6 or Artix-7 families for improved performance per watt if power efficiency is critical. Evaluate pin count requirements as the 128-pin limit may constrain complex system integration. Consider lead times for legacy components which may exceed standard availability windows.
This component is part of the Spartan-3E family, designed for entry-level to mid-range FPGA applications. It serves as a bridge between lower-density Spartan-3 devices and higher-performance Virtex series chips, offering a balance of cost and capability for mass-market electronics.
Direct pin-to-pin replacements are not available due to architectural differences. Equivalent functionality requires redesigning the board layout for compatible devices such as the LFE5U or ECP5 families, noting changes in configuration methods and I/O constraints.
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