XCVC1502-1MSENSVG1369

Soc System On Chip Overview

The XCVC1502-1MSENSVG1369 is a Versal Adaptive SoC from AMD/Xilinx, designed for high-performance computing and data center acceleration. It integrates AI Engines, programmable logic, and processing systems on a single chip. The device utilizes an FCBGA-1369 package with surface mount technology. Operating parameters include a minimum temperature of 0°C and a maximum of +100°C. The core voltage is specified at 800 mV. This component belongs to the System-On-Chip category, supporting complex heterogeneous architectures for advanced signal processing and network applications.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining AI Engines, programmable logic, and processing subsystems
• Versal platform integration for adaptive hardware acceleration
• High-density FCBGA packaging for advanced board-level integration

Soc System On Chip Applications

• Data center acceleration and cloud infrastructure
• Network and telecommunications equipment
• Radar and high-end signal processing systems

Soc System On Chip Procurement Notes

Verify availability status carefully as this part may be subject to limited supply or factory special orders. Confirm RoHS compliance details through official datasheets before procurement. Ensure compatibility with existing design constraints regarding the FCBGA-1369 package and thermal requirements for the specified operating temperature range.

Soc System On Chip Selection Notes

Select this model when requiring a Versal Adaptive SoC with specific I/O density provided by the SVG1369 suffix. Consider the 800 mV core voltage requirement for power delivery design. Evaluate the 0°C to +100°C operating range against environmental conditions. Compare resource needs against other XCVC1502 variants if different package options are preferred.

Soc System On Chip Part Context

This component is part of the AMD/Xilinx Versal family, specifically the XCVC1502 series. It represents a System-On-Chip solution leveraging TSMC 7nm HK-MG FinFET process technology. The device supports advanced features like UltraRAM and hardened DSP blocks, positioning it within the premium adaptive SoC segment for demanding computational tasks.

Soc System On Chip Replacement Considerations

Check for direct pin-compatible substitutes within the XCVC1502 family. Verify if alternative suffixes offer identical electrical characteristics while providing different package or temperature grades. Consult AMD documentation for cross-reference lists to ensure functional equivalence in existing designs.