XCVC1502-2MLINSVG1369

Soc System On Chip Overview

The XCVC1502-2MLINSVG1369 is an Adaptive SoC from the AMD Versal Premium series, manufactured by AMD/Xilinx. It integrates programmable logic, AI Engines, and processing systems on a single chip. The device utilizes an FCBGA-1369 package for surface mount installation. Operating specifications include a minimum temperature of 0°C and a maximum operating temperature of +100°C. The core voltage is specified at 800 mV. This component is classified as a System-On-a-Chip (SoC) FPGA designed for high-performance computing applications.

Soc System On Chip Feature Summary

• Heterogeneous integration of adaptive logic, AI vector engines, and processing subsystems within a single chip architecture.
• Support for advanced network protocols and high-speed data transmission through integrated hardened IP blocks.
• Built-in security features including hardware trust roots and encryption engines to protect intellectual property.

Soc System On Chip Applications

• Data center acceleration workloads
• Network and telecommunications infrastructure
• Radar and high-end signal processing systems

Soc System On Chip Procurement Notes

Verify availability status directly with authorized distributors or the manufacturer, as supply may be limited or restricted in certain regions. Confirm that the specific ordering suffix matches the required performance grade and package variant. Ensure compliance with RoHS directives and other relevant trade regulations before finalizing procurement orders.

Soc System On Chip Selection Notes

Select this model when requiring high-density logic resources combined with dedicated AI processing capabilities. Evaluate thermal management requirements carefully due to the high power density associated with the Versal Premium series. Ensure PCB design supports the FCBGA-1369 package constraints and provides adequate power delivery for the 800 mV core voltage domain.

Soc System On Chip Part Context

This part belongs to the AMD Versal Premium family, which targets compute-intensive memory-bound workloads. It builds upon the Versal architecture to offer increased bandwidth and lower power consumption compared to previous generations. The device is positioned for applications requiring significant parallel processing and high-speed interconnectivity.

Soc System On Chip Replacement Considerations

Consider the XCVC1702-2LLINSVG1369 for higher resource requirements within the same package form factor. Verify pin compatibility and software toolchain support when migrating between different Versal models to ensure seamless integration into existing designs.