Soc System On Chip XCVC1702-1LLINSVG1369 product image

XCVC1702-1LLINSVG1369

$25,765.63
  • Description:IC VERSAL AI-CORE FPGA 1369BGA
  • Series:Versal™ AI Core

SKU:3b097ce73692 Category: Brand:

  
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XCVC1702-1LLINSVG1369 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSAL AI-CORE FPGA 1369BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCVC1702-1LLINSVG1369

  • Description:IC VERSAL AI-CORE FPGA 1369BGA
  • Series:Versal™ AI Core
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size:-
  • RAM Size:-
  • Peripherals:DDR, DMA, PCIe
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:400MHz, 1GHz
  • Primary Attributes:Versal™ AI Core FPGA, 1M Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:1369-BFBGA, FCBGA
  • Supplier Device Package:1369-FCBGA (35x35)

Soc System On Chip datasheet and documents for XCVC1702-1LLINSVG1369

XCVC1702-1LLINSVG1369

Soc System On Chip Overview

The AMD XCVC1702-1LLINSVG1369 is a Versal Premium Adaptive SoC FPGA in the XCVC1702 series, housed in a 1369-ball FCBGA package. It integrates programmable logic, AI Engines, processing systems, and high-speed transceivers on a single chip. The device supports advanced packaging technologies and offers configurable I/O standards for diverse system interfaces.

Soc System On Chip Feature Summary

  • Heterogeneous architecture combining programmable logic, AI vector engines, and Arm-based processing subsystems
  • Integrated high-speed serial transceivers supporting multiple data rates for network and storage connectivity
  • Hardware-adaptable fabric allowing customization for specific compute and acceleration workloads

Soc System On Chip Applications

  • Data center infrastructure acceleration
  • High-performance computing (HPC) applications
  • Telecommunications and 5G baseband processing
  • Advanced radar and signal processing systems

Soc System On Chip Procurement Notes

Verify the exact suffix '1LLINSVG1369' against official AMD documentation to confirm temperature grade, speed bin, and package variant. Ensure compatibility with required power delivery and thermal management solutions for the FCBGA-1369 form factor before procurement.

Soc System On Chip Selection Notes

Select this model when high logic density and integrated AI capabilities are required within a single adaptive SoC. Compare resource counts such as LUTs, DSP blocks, and AI Engine tiles against application needs. Verify that the 1369-ball package fits the target PCB layout constraints.

Soc System On Chip Part Context

This component belongs to the AMD Versal Premium series, designed for demanding enterprise and infrastructure workloads. It sits alongside other XCVC models offering varying resource scales, providing a scalable solution for complex system-on-chip designs requiring both flexibility and performance.

Soc System On Chip Replacement Considerations

Check for direct pin-to-pin compatible upgrades within the XCVC1702 family or newer Versal generations. Ensure functional equivalence in terms of AI Engine count, transceiver lanes, and processing system cores before substituting.

XCVC1702-1LLINSVG1369XCVC1702-1LLINSVG1369
$25,765.63
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