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XCVC1702-1LLINSVG1369 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSAL AI-CORE FPGA 1369BGA. Review the specifications below when checking this part for your BOM.
The AMD XCVC1702-1LLINSVG1369 is a Versal Premium Adaptive SoC FPGA in the XCVC1702 series, housed in a 1369-ball FCBGA package. It integrates programmable logic, AI Engines, processing systems, and high-speed transceivers on a single chip. The device supports advanced packaging technologies and offers configurable I/O standards for diverse system interfaces.
Verify the exact suffix '1LLINSVG1369' against official AMD documentation to confirm temperature grade, speed bin, and package variant. Ensure compatibility with required power delivery and thermal management solutions for the FCBGA-1369 form factor before procurement.
Select this model when high logic density and integrated AI capabilities are required within a single adaptive SoC. Compare resource counts such as LUTs, DSP blocks, and AI Engine tiles against application needs. Verify that the 1369-ball package fits the target PCB layout constraints.
This component belongs to the AMD Versal Premium series, designed for demanding enterprise and infrastructure workloads. It sits alongside other XCVC models offering varying resource scales, providing a scalable solution for complex system-on-chip designs requiring both flexibility and performance.
Check for direct pin-to-pin compatible upgrades within the XCVC1702 family or newer Versal generations. Ensure functional equivalence in terms of AI Engine count, transceiver lanes, and processing system cores before substituting.
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