XCVC1702-1LSEVSVA2197

Soc System On Chip Overview

The XCVC1702-1LSEVSVA2197 is a Versal Prime Series System-on-Chip FPGA manufactured by AMD. It utilizes a 2197-ball FCBGA package and operates within a junction temperature range of 0°C to +100°C. The device integrates dual-core Arm Cortex-A72 application processors and dual-core Arm Cortex-R5F real-time processors. Key electrical specifications include a core operating voltage of 700 mV. The component supports SMD/SMT mounting and complies with RoHS standards, serving as a high-performance adaptive SoC for complex computing tasks.

Soc System On Chip Feature Summary

• Integrates software-programmable silicon infrastructure with dedicated compute engines for diverse workload acceleration
• Combines processing system cores with programmable logic and AI Engines on a single die
• Provides extensive connectivity options including high-speed serial interfaces and memory controllers

Soc System On Chip Applications

• Data center network and storage acceleration
• SmartNIC implementations
• 5G xHaul and Nx100G Ethernet networking
• Communications test equipment

Soc System On Chip Procurement Notes

Verify the specific ordering suffix against official AMD documentation to ensure correct speed grade and package variant. Confirm that the requested part matches the exact Versal Prime series designation. Check current manufacturing status and lead times directly with authorized distributors or AMD sales representatives prior to order placement.

Soc System On Chip Selection Notes

Select this model when requiring the specific logic density and I/O count of the XCVC1702 device within the Versal Prime family. Ensure the design requirements align with the available GT transceivers and memory controller interfaces. Compare performance metrics against other Versal variants if different compute engine counts or connectivity options are needed.

Soc System On Chip Part Context

This component belongs to the AMD Versal Prime series, which targets high-performance networking and data center applications. It sits between standard Versal devices and higher-end Premium or HBM series in terms of feature set and cost. The series emphasizes energy efficiency and flexible connectivity for modern infrastructure workloads.

Soc System On Chip Replacement Considerations

Direct replacements must match the 2197 FCBGA footprint and Versal Prime architecture. Verify pin-to-pin compatibility with alternative AMD Versal models if upgrading or downgrading logic capacity. Consult AMD's product selection guide for equivalent parts with similar I/O and processor configurations.