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XCVC1702-1MLINSVG1369 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSAL AI-CORE FPGA 1369BGA. Review the specifications below when checking this part for your BOM.
The XCVC1702-1MLINSVG1369 is an AMD Xilinx Versal Premium Adaptive SoC FPGA. It integrates programmable logic, AI Engines, processing systems, and high-speed transceivers on a single chip. The device operates at a core voltage of 800 mV and supports a commercial temperature range from -40°C to +110°C. It utilizes a 1369-ball FCBGA package for surface mount installation. This component is designed for high-performance computing applications requiring significant data throughput and low latency.
Verify availability through authorized distributors as supply may be limited. Confirm the specific suffix matches project requirements. Ensure ESD protection measures are in place during handling. Check RoHS compliance documentation before finalizing procurement orders.
Evaluate resource requirements against available logic cells and DSP engines. Consider thermal management solutions due to high power density. Verify pin compatibility with existing PCB layouts. Assess toolchain support for development efficiency.
This part belongs to the AMD Xilinx Versal Premium series, targeting enterprise and industrial markets. It represents a shift towards adaptive compute architectures that blend CPU, GPU, and FPGA capabilities. The Versal platform emphasizes energy efficiency and performance per watt for complex workloads.
Check for updated versions within the same Versal family. Compare pinouts and electrical characteristics carefully. Validate software compatibility with existing design flows.
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