XCVC1702-2LLENSVG1369

Soc System On Chip Overview

The AMD XCVC1702-2LLENSVG1369 is a Versal Premium Adaptive SoC FPGA designed for high-performance computing and data center acceleration. It integrates programmable logic, AI Engines, and Arm Cortex-A72/R5F processing systems on a single chiplet. The device features approximately 14,800 DSP engines and 14,800 K of system logic units. It supports high-speed serial transceivers up to 112 Gb/s PAM4 and includes High Bandwidth Memory (HBM) interfaces. The component utilizes a 1369-ball FCBGA package, enabling dense I/O configurations for complex signal processing and network applications.

Soc System On Chip Feature Summary

• Integrates heterogeneous compute resources including AI Engines, DSP blocks, and programmable logic within a single adaptive SoC architecture.
• Supports high-throughput data movement via advanced NoC interconnects and high-speed GT transceivers for PCIe Gen5 and Ethernet connectivity.
• Combines hardened Arm Cortex-A72 application processors with Cortex-R5F real-time cores for flexible control and management tasks.

Soc System On Chip Applications

• Data center acceleration for machine learning inference and computational storage
• High-speed networking infrastructure and telecom baseband processing
• Advanced radar systems and electronic warfare signal processing

Soc System On Chip Procurement Notes

Verify the specific suffix 'V' indicates voltage or temperature grade compliance as per the official datasheet. Confirm the 'S' in the package code corresponds to the correct ball count and thermal characteristics. Ensure the ordering part number matches the exact speed grade '-2' required for your timing closure constraints before finalizing procurement.

Soc System On Chip Selection Notes

Select this model when requiring significant DSP density combined with AI Engine capabilities for parallel vector processing. Compare against lower-tier Versal models if HBM integration or specific transceiver counts are not needed. Evaluate power consumption estimates using AMD Power Design Manager tools early in the design phase due to the high performance density of the Premium series.

Soc System On Chip Part Context

This component belongs to the AMD Xilinx Versal Premium family, which bridges the gap between traditional FPGAs and fixed-function ASICs. It is positioned above the Versal AI Edge series in terms of logic and DSP resources but differs from the Versal AI Core series by its focus on mixed-signal and RF capabilities in other variants. It serves as a key building block for next-generation infrastructure platforms.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package are limited to other XCVC1702 variants with different speed grades or industrial temperature ranges. Cross-family migration to Virtex UltraScale+ requires significant PCB and firmware redesign due to architectural differences in memory controllers and I/O standards.