XCVC1702-2MLENSVG1369

Soc System On Chip Overview

The AMD XCVC1702-2MLENSVG1369 is a Versal Premium Adaptive SoC FPGA designed for high-performance computing and data center acceleration. It integrates programmable logic, AI Engines, DSP blocks, and hardened processing subsystems on a single chip. The device utilizes an FCBGA-1369 package to support dense I/O configurations. Key specifications include the integration of Arm Cortex-A72 application processors and Cortex-R5F real-time cores within the processing system. The architecture supports high-speed serial transceivers capable of advanced signaling rates, enabling connectivity for PCIe Gen5 and multi-gigabit Ethernet interfaces essential for modern network infrastructure.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining programmable logic, AI Engines, and hardened IP for optimized workload distribution
• Integrated dual-core Arm Cortex-A72 and dual-core Cortex-R5F processing subsystems for control and real-time tasks
• Support for high-speed GT transceivers enabling PCIe Gen5 and 100G/600G Ethernet connectivity
• Hardware security features including hardware root of trust and NIST-validated cryptographic algorithms

Soc System On Chip Applications

• Data center compute acceleration and cloud infrastructure
• 5G radio access network beamforming and signal processing
• High-speed networking and telecommunications equipment
• Radar systems and advanced signal processing applications

Soc System On Chip Procurement Notes

Verify the specific ordering suffix against the official AMD datasheet to ensure correct speed grade and temperature range. Confirm package availability as distribution channels may have limited stock for premium series components. Request original manufacturer documentation to validate authenticity and revision history before procurement.

Soc System On Chip Selection Notes

Evaluate the required number of AI Engine tiles and DSP blocks against the XCVC1702 resource map to ensure sufficient compute capacity. Assess PCB layer count and thermal design requirements due to the high pin density of the FCBGA-1369 package. Verify compatibility with Vivado and Vitis toolchains for logic synthesis and software development.

Soc System On Chip Part Context

This component belongs to the AMD Versal Premium series, targeting enterprise and industrial markets requiring significant adaptive compute capabilities. It sits above the AI Core series in terms of logic resources and integrated memory controllers, offering enhanced scalability for complex system-on-chip designs.

Soc System On Chip Replacement Considerations

Consult the AMD Versal product selection guide for direct functional equivalents within the XCVC1702 family. Cross-referencing speed grades and package types is essential when considering alternative part numbers from the same series.