XCVC1702-2MLIVSVA2197

Soc System On Chip Overview

The XCVC1702-2MLIVSVA2197 is a Versal Prime adaptive SoC manufactured by AMD. It integrates an AI Engine array with programmable logic and embedded processors, built on TSMC 7nm HK-MG FinFET technology. The device features dual-core ARM Cortex-A72 MPCore and dual-core ARM Cortex-R5F processors. It operates at a minimum voltage of 800 mV and supports industrial temperature ranges from 0°C to +110°C. The component is housed in a 2197-ball FCBGA package.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining AI Engines, programmable logic, and hardened processor cores
• Integrated high-bandwidth memory controllers and PCIe Gen4 interfaces
• Advanced power management with dynamic voltage and frequency scaling

Soc System On Chip Applications

• High-performance network acceleration
• Industrial automation control systems
• Medical imaging processing

Soc System On Chip Procurement Notes

Verify the specific suffix 'MLI' against official AMD documentation to confirm the exact speed grade and commercial/industrial temperature rating. Ensure the ordering part number matches the required performance bin for your design constraints before finalizing procurement.

Soc System On Chip Selection Notes

Select this model when requiring the Versal Prime series capabilities within the 2197 package footprint. Confirm that the 7nm process node and specific I/O count meet the system's bandwidth and logic density requirements compared to other Versal variants.

Soc System On Chip Part Context

This component belongs to the AMD Versal Prime family, designed for applications needing significant parallel processing alongside traditional CPU execution. It sits between the entry-level Versal AI Edge and the high-end Versal AI Core series in terms of resource allocation.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package are limited to other Versal Prime devices with compatible speed grades. Verify electrical compatibility and software toolchain support before substituting with similar part numbers.