XCVC1802-1MLIVSVD1760

Soc System On Chip Overview

The XCVC1802-1MLIVSVD1760 is a Versal Prime Series SoC FPGA manufactured by AMD. It operates at a minimum working temperature of -40°C and a maximum of +110°C, with a core voltage of 800 mV. The device utilizes an MLIVSV package configuration within the System-On-Chip category.

Soc System On Chip Applications

• Data center network acceleration
• SmartNIC implementations
• 5G xHaul infrastructure

Soc System On Chip Procurement Notes

Verify current availability status directly with authorized distributors or the manufacturer, as supply constraints may apply to this specific part number. Confirm RoHS compliance details and ensure the ordering suffix matches the required package and temperature grade specifications for the target application environment.

Soc System On Chip Selection Notes

Select this component based on its placement in the Versal Prime series, which targets high-performance adaptive computing needs. Ensure the design accommodates the specified operating temperature range and power requirements. Validate that the MLIVSV package dimensions align with the PCB layout constraints and thermal management strategy.

Soc System On Chip Part Context

This model belongs to the AMD Versal Prime family, designed for software-programmable silicon infrastructure combined with compute engines. It serves as a foundational adaptive SoC for accelerating diverse workloads across networking, storage, and telecommunications markets through integrated processing and programmable logic.

Soc System On Chip Replacement Considerations

Consult official AMD documentation for verified cross-references. Substitution requires matching the Versal Prime series architecture, package type, and electrical specifications to maintain system compatibility.