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XCVC1802-1MSEVSVA2197 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSAL AICORE FPGA 2197BGA. Review the specifications below when checking this part for your BOM.
The XCVC1802-1MSEVSVA2197 is a Versal Prime Series System-on-Chip FPGA manufactured by AMD. It utilizes a 2197-ball FCBGA package with dimensions of 45x45 mm. The device integrates dual-core Arm Cortex-A72 and dual-core Arm Cortex-R5F processing units. Key electrical parameters include an operating voltage of 800 mV and a junction temperature range from 0°C to +100°C. The component supports SMD/SMT mounting and contains approximately 1.9 million logic cells.
Verify the specific suffix 'A2197' against official AMD documentation to confirm package type and thermal specifications. Ensure compatibility with the Versal Prime series toolchain, including Vivado and Vitis platforms. Confirm RoHS compliance status through current manufacturer declarations before procurement.
Select this model for applications requiring high-performance adaptive computing with integrated ARM cores. Verify that the 2197-ball FCBGA package fits the target PCB layout constraints. Ensure the design supports the required power delivery for the 800 mV core voltage and manages thermal dissipation within the specified operating temperature range.
This component belongs to the AMD Versal Prime family, designed for high-performance computing and networking workloads. It serves as a bridge between traditional FPGAs and application-specific accelerators, offering flexibility through its adaptive compute architecture.
Consult AMD's official product selection guide for direct pin-compatible or functionally equivalent Versal Prime devices. Verify cross-references only through authorized distributor databases or manufacturer PCNs.
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