XCVC1802-2LLIVSVA2197

Soc System On Chip Overview

The AMD XCVC1802-2LLIVSVA2197 is an Adaptive SoC belonging to the Versal AI Core series, designed for high-performance computing and networking applications. It integrates a programmable logic fabric with fixed-function hardware engines and embedded processors. The device features 1,656 system logic cells (K) and 756,000 Look-Up Tables (LUTs). It includes 1,440 DSP Engines and supports up to 770 maximum I/O pins. The processing subsystem comprises a dual-core Arm Cortex-A72 Application Processing Unit and a dual-core Arm Cortex-R5F Real-Time Processing Unit. Connectivity options include PCIe Gen4 interfaces and support for DDR4 memory controllers.

Soc System On Chip Feature Summary

• Integrates adaptive SoC architecture combining programmable logic with fixed-function hardware accelerators
• Provides extensive connectivity through PCIe Gen4 interfaces and multiple high-speed serial transceivers
• Supports rapid application development via pre-built system infrastructure and integrated shells
• Enables real-time processing and complex data analysis through dedicated DSP engines and ARM processor cores

Soc System On Chip Applications

• Data center network acceleration
• SmartNIC implementations
• 5G xHaul infrastructure
• Nx100G Ethernet and OTN networking
• Communications test equipment

Soc System On Chip Procurement Notes

Verify the specific suffix LLIV within the part number XCVC1802-2LLIVSVA2197 against official AMD documentation to confirm package type, temperature grade, and speed bin. Ensure compatibility with required power delivery and thermal management solutions for the FCBGA-2197 package. Confirm availability of necessary design tools such as Vivado Design Suite and Vitis Unified Software Platform for development.

Soc System On Chip Selection Notes

Select this component when requiring a balance of high logic density and significant DSP capabilities within the Versal AI Core portfolio. Compare against the Versal Prime series if AI-specific engines are not required. Evaluate the 1,656K logic cell count against project complexity. Consider the integrated memory controllers and NoC ports for bandwidth-intensive data paths.

Soc System On Chip Part Context

This part belongs to the AMD Versal AI Core series, distinct from the Versal Prime or Versal Premium lines. It targets applications demanding both high-throughput data processing and flexible logic implementation. The device shares the 2197-ball FCBGA package form factor common across several Versal models, facilitating potential mechanical design reuse within product families.

Soc System On Chip Replacement Considerations

Direct replacements must match the XCVC1802 logic density and 2197-package footprint. Verify pin-to-pin compatibility with existing designs. Alternative Versal devices may require retiming or resource optimization due to differences in DSP engine counts or NoC port configurations.