XCVC1802-2LSEVSVA2197

Soc System On Chip Overview

The AMD XCVC1802-2LSEVSVA2197 is a Versal AI Core Series adaptive SoC housed in a 2197-pin FCBGA package. It integrates dual-core ARM Cortex-A72 processors, dual-core ARM Cortex-R5F real-time processors, and approximately 1.8 million logic units (LUTs). The device features dedicated AI Engines (AIE) and DSP engines for high-performance computing. Key interfaces include PCIe Gen4, SFP28, QSFP28, HDMI, DDR4/LPDDR4 memory controllers, and FMC connectors. Operating temperatures range from 0°C to 100°C TJ.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining programmable logic, AI engines, DSP engines, and ARM processors on a single chip.
• Integrated programmable network-on-chip (NoC) for high-speed data transfer between compute engines.
• Supports diverse connectivity options including high-speed optical interfaces and standard Ethernet ports.
• Utilizes pre-built system infrastructure shells to accelerate hardware and software development cycles.

Soc System On Chip Applications

• Data center networking and storage acceleration
• SmartNIC implementations
• 5G xHaul infrastructure
• Nx100G Ethernet and OTN networks
• Communication test equipment

Soc System On Chip Procurement Notes

Verify the specific suffix '2LSEVSVA2197' against official AMD documentation to confirm temperature grade and package variant. Ensure compatibility with required power delivery specifications for the Versal AI Core series. Confirm lead times directly with authorized distributors as manufacturing schedules vary. Validate that the selected version meets all regulatory compliance requirements for the target deployment region.

Soc System On Chip Selection Notes

Select this model when high-density AI inference and real-time control are required within a single adaptive SoC. Compare logic unit counts against XCVM Prime series if AI engine resources are not needed. Verify interface requirements such as PCIe Gen4 and optical transceiver support before finalizing the design. Consider thermal management solutions suitable for the FCBGA package and operating temperature range.

Soc System On Chip Part Context

This component belongs to the AMD Versal AI Core series, designed for applications requiring significant parallel processing capabilities alongside traditional FPGA flexibility. It sits above the Versal Prime series in terms of AI engine integration but shares similar processor cores and I/O capabilities. The part number indicates specific speed grades and package configurations within the broader Versal ecosystem.

Soc System On Chip Replacement Considerations

Direct replacements may include other Versal AI Core devices with higher or lower logic densities, such as the XCVC1902 or XCVC902, depending on resource requirements. Cross-series migration to Versal Prime requires re-evaluation of AI engine dependencies. Verify pin-to-pin compatibility and software toolchain support before substituting.