XCVC1802-2MLIVSVD1760

Soc System On Chip Overview

The XCVC1802-2MLIVSVD1760 is an AMD Versal Prime Series System-on-Chip (SoC) FPGA. It operates at a core voltage of 800 mV and supports a commercial temperature range from -40°C to +110°C. The device integrates software-programmable silicon infrastructure with compute engines and connectivity options for diverse workloads.

Soc System On Chip Feature Summary

• Combines programmable logic with hardened processing subsystems
• Supports high-performance networking and storage acceleration
• Enables rapid application development through integrated shell infrastructure

Soc System On Chip Applications

• Data center network and storage acceleration
• SmartNIC implementations
• 5G xHaul infrastructure
• Nx100G Ethernet and OTN networking
• Communications test equipment

Soc System On Chip Procurement Notes

Verify availability status directly with authorized distributors or the manufacturer, as supply may be limited or restricted. Confirm RoHS compliance details and specific ordering suffixes against official datasheets before procurement to ensure compatibility with target system requirements.

Soc System On Chip Selection Notes

Select this component for applications requiring adaptive SoC flexibility combined with fixed-function performance. Evaluate thermal management needs due to the dense integration of compute engines and I/O interfaces within the specified package configuration.

Soc System On Chip Part Context

This part belongs to the AMD Versal Prime series, designed to accelerate workloads in data center and telecommunications markets. It provides a balance of programmability and hardware acceleration capabilities compared to other Versal tiers.

Soc System On Chip Replacement Considerations

Consult official AMD documentation for verified cross-references or pin-compatible alternatives within the Versal family. Ensure functional equivalence in processing units and I/O standards when considering substitutes.