Soc System On Chip XCVC1902-1MSEVSVD1760 product image

XCVC1902-1MSEVSVD1760

$19,479.88
  • Description:IC VERSAL AICORE FPGA 1760BGA
  • Series:Versal™ AI Core

SKU:181ae6354b39 Category: Brand:

  
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XCVC1902-1MSEVSVD1760 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSAL AICORE FPGA 1760BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCVC1902-1MSEVSVD1760

  • Description:IC VERSAL AICORE FPGA 1760BGA
  • Series:Versal™ AI Core
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DDR, DMA, PCIe
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:600MHz, 1.3GHz
  • Primary Attributes:Versal™ AI Core FPGA, 1.9M Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:1760-BFBGA, FCBGA
  • Supplier Device Package:1760-FCBGA (40x40)

Soc System On Chip datasheet and documents for XCVC1902-1MSEVSVD1760

XCVC1902-1MSEVSVD1760

Soc System On Chip Overview

The XCVC1902-1MSEVSVD1760 is an AMD Versal AI Core System-on-Chip (SoC) FPGA. It integrates programmable logic, AI engines, and processor subsystems within a single adaptive architecture. The device operates at a core voltage of 800 mV and supports a minimum operating temperature of -40°C and a maximum of +110°C. It utilizes the FCBGA-1760 package configuration. This component belongs to the Versal AI Core family, designed for high-throughput applications requiring significant computational density.

Soc System On Chip Feature Summary

  • Integrates AI engines and DSP blocks for parallel processing acceleration
  • Combines programmable logic with hardened processor subsystems
  • Supports high-bandwidth data movement via configurable network-on-chip

Soc System On Chip Applications

  • High-performance AI inference workloads
  • Signal processing and radio frequency applications
  • Data center compute acceleration

Soc System On Chip Procurement Notes

Verify availability through authorized distributors as supply may be limited or subject to factory special orders. Confirm RoHS compliance status and specific packaging details directly with the manufacturer or supplier before finalizing procurement plans.

Soc System On Chip Selection Notes

Select this model when Versal AI Core performance levels are required. Ensure the design accommodates the specific thermal requirements associated with the -40°C to +110°C operating range and the 800 mV core voltage specification.

Soc System On Chip Part Context

This part is a member of the AMD Versal AI Core series, which targets demanding edge and cloud applications. It shares architectural similarities with other VC1902 variants but differs in package type and speed grade. The 1760-ball FCBGA package defines its physical footprint and I/O distribution constraints.

Soc System On Chip Replacement Considerations

Direct substitutes include other XCVC1902 variants such as XCVC1902-1MLIVSVD1760 or XCVC1902-3HSEVSVD1760, provided the pinout and electrical characteristics match the specific design requirements.

XCVC1902-1MSEVSVD1760XCVC1902-1MSEVSVD1760
$19,479.88
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