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XCVC2602-2HSIVSVH1760 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is XCVC2602-2HSIVSVH1760. Review the specifications below when checking this part for your BOM.
The AMD XCVC2602-2HSIVSVH1760 is a Versal Premium SoC FPGA manufactured by AMD. It utilizes the TSMC 7nm HK-MG FinFET process technology and features an FCBGA-1760 package. The device integrates ARM Cortex-A72 and ARM Cortex-R5F processor cores within its programmable logic fabric. Official specifications indicate a minimum operating temperature of -40°C and a maximum operating temperature of +110°C. The component operates at a core voltage of 800 mV. It belongs to the Versal adaptive SoC family, designed for high-performance computing applications requiring heterogeneous integration.
Verify availability through authorized AMD distributors as supply status may be restricted. Confirm exact ordering suffixes match project requirements. Request official datasheets and compliance documentation prior to procurement. Ensure compatibility with existing board designs regarding thermal management and power delivery networks.
Select this model when high logic density and integrated processing capabilities are required. Compare against other Versal series devices based on specific I/O count and memory interface needs. Consider the 1760-pin package constraints during PCB layout planning. Evaluate thermal performance requirements given the 7nm process characteristics.
This component is part of the AMD Versal Premium series, which combines AI Engine architecture with programmable logic and processing systems. The Versal platform targets complex workloads requiring low latency and high bandwidth. It represents a shift towards heterogeneous computing architectures in FPGA design.
Direct substitutes include other XCVC2602 variants with different speed grades or package options. Verify pin-to-pin compatibility before replacing. Cross-reference with XCVP series if AI Engine resources are not required.
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