Soc System On Chip XCVE1752-2MLENSVG1369 product image

XCVE1752-2MLENSVG1369

$19,314.13
  • Description:IC VERSAL AI-CORE FPGA 1369BGA
  • Series:Versal™ AI Core

SKU:28c891d42024 Category: Brand:

  
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XCVE1752-2MLENSVG1369 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSAL AI-CORE FPGA 1369BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCVE1752-2MLENSVG1369

  • Description:IC VERSAL AI-CORE FPGA 1369BGA
  • Series:Versal™ AI Core
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DDR, DMA, PCIe
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:600MHz, 1.4GHz
  • Primary Attributes:Versal™ AI Edge FPGA, 1M Logic Cells
  • Operating Temperature:0°C ~ 110°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:1369-BFBGA, FCBGA
  • Supplier Device Package:1369-FCBGA (35x35)

Soc System On Chip datasheet and documents for XCVE1752-2MLENSVG1369

XCVE1752-2MLENSVG1369

Soc System On Chip Overview

The XCVE1752-2MLENSVG1369 is an AMD Xilinx Versal Premium Adaptive SoC designed for high-performance data center and infrastructure applications. It integrates a heterogeneous architecture featuring programmable logic, AI Engines, DSP engines, and a processing subsystem with dual-core Arm Cortex-A72 and dual-core Cortex-R5F processors. The device utilizes a 1369-ball FCBGA package and operates within a temperature range of -40°C to +110°C. Key electrical parameters include a core voltage of 700 mV. This component supports advanced interconnects and hardened IP blocks suitable for complex signal processing and acceleration tasks.

Soc System On Chip Feature Summary

  • Heterogeneous architecture combining programmable logic, AI Engines, and processing systems on a single chip
  • Integrated hardened IP blocks supporting high-speed serial transceivers and network protocols
  • Dual-core Arm Cortex-A72 application processor and dual-core Cortex-R5F real-time processor
  • Advanced power management capabilities with dynamic voltage and frequency scaling

Soc System On Chip Applications

  • Data center acceleration and cloud infrastructure
  • High-performance computing (HPC) and artificial intelligence workloads
  • Telecommunications and 5G baseband processing
  • Radar and advanced signal processing systems

Soc System On Chip Procurement Notes

Verify the specific ordering suffix to ensure correct speed grade and package variant. Confirm RoHS compliance status through official datasheets. Check current availability as supply may be limited or subject to factory orders. Ensure compatibility with required development tools such as Vivado and Vitis before procurement.

Soc System On Chip Selection Notes

Select this model for applications requiring large-scale parallel processing and low-latency control. Evaluate thermal requirements due to high performance density. Consider PCB layer count and signal integrity needs for the 1369-ball BGA package. Verify that the available AI Engine tiles and DSP resources meet the specific algorithmic demands of the target design.

Soc System On Chip Part Context

This part belongs to the AMD Xilinx Versal Premium series, targeting enterprise and infrastructure markets. It represents a generation of adaptive SoCs that merge CPU, FPGA, and AI compute capabilities. The XCVE1752 designation indicates a specific resource configuration within the Versal family, distinct from Edge or AI Core variants.

Soc System On Chip Replacement Considerations

Check for updated speed grades within the XCVE1752 family. Consider XCVP1802 for higher resource counts in similar packages. Verify pin-to-pin compatibility if substituting within the same package type.

XCVE1752-2MLENSVG1369XCVE1752-2MLENSVG1369
$19,314.13
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