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XCVM1302-1LSIVFVC1596 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSALPRIME ACAP FPGA 1596BGA. Review the specifications below when checking this part for your BOM.
The XCVM1302-1LSIVFVC1596 is an AMD Versal Premium Adaptive SoC featuring a heterogeneous architecture with programmable logic, AI Engines, and DSP engines. It includes dual-core Arm Cortex-A72 application processors and dual-core Arm Cortex-R5F real-time processors. The device integrates high-bandwidth memory controllers supporting LPDDR4x and DDR4, alongside advanced I/O interfaces including PCIe Gen4/Gen5 and 112 Gb/s PAM4 transceivers. This configuration supports complex data processing and low-latency acceleration for demanding edge and infrastructure applications.
Verify the specific ordering suffix against the official AMD datasheet to confirm package type, temperature range, and industrial qualification status. Ensure compatibility with the required Vivado and Vitis tool versions for the selected speed grade before finalizing procurement orders.
Select this model based on the requirement for integrated HBM or high-bandwidth LPDDR4x memory interfaces combined with significant AI Engine resources. Evaluate the specific speed grade requirements against target clock frequencies for both the programmable logic and processor subsystems to ensure timing closure feasibility.
This component belongs to the AMD Versal Premium series, designed for high-end adaptive computing. It bridges the gap between traditional FPGAs and fixed-function ASICs by offering software-programmable hardware acceleration. The series targets applications requiring massive parallelism and deterministic latency in evolving protocol environments.
Direct pin-to-pin replacements are limited within the Versal family due to varying resource densities and I/O configurations. Consider the XCVM1802 or XCVM2602 models for higher capacity needs, ensuring that the new part number supports the same package footprint and thermal design power constraints.
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