Soc System On Chip XCVM1302-1LSIVSVD1760 product image

XCVM1302-1LSIVSVD1760

$4,672.88
  • Description:IC VERSALPRIME ACAP FPGA 1760BGA
  • Series:Versal™ Prime

SKU:0ae77ed94b80 Category: Brand:

  
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XCVM1302-1LSIVSVD1760 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSALPRIME ACAP FPGA 1760BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCVM1302-1LSIVSVD1760

  • Description:IC VERSALPRIME ACAP FPGA 1760BGA
  • Series:Versal™ Prime
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size:-
  • RAM Size:-
  • Peripherals:DDR, DMA, PCIe
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:400MHz, 1GHz
  • Primary Attributes:Versal™ Prime FPGA, 70k Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:1760-BFBGA, FCBGA
  • Supplier Device Package:1760-FCBGA (40x40)

Soc System On Chip datasheet and documents for XCVM1302-1LSIVSVD1760

XCVM1302-1LSIVSVD1760

Soc System On Chip Overview

The XCVM1302-1LSIVSVD1760 is a Versal AI Core Series System-on-Chip FPGA manufactured by AMD. It features an FCBGA-1760 package and integrates ARM Cortex-A72 and Cortex-R5F processor cores. The device supports maximum clock frequencies of 400 MHz for the application processors and 1 GHz for the real-time processors. Cache configurations include L1 instruction memory of 2 x 48 kB and 2 x 32 kB, alongside L1 data memory of 2 x 32 kB and 2 x 32 kB. This component is designed for high-performance adaptive computing applications requiring scalable processing capabilities.

Soc System On Chip Feature Summary

  • Integrates heterogeneous computing engines including AI, DSP, and programmable logic within a single SoC architecture.
  • Combines multi-core ARM processor subsystems with adaptive compute tiles for flexible workload acceleration.
  • Supports high-speed serial connectivity through integrated transceivers for demanding data throughput requirements.

Soc System On Chip Applications

  • High-throughput AI inference at the network edge
  • Advanced signal processing for wireless infrastructure
  • Data center acceleration and storage optimization

Soc System On Chip Procurement Notes

Verify the specific ordering suffix to ensure correct package type, temperature range, and speed grade. Confirm RoHS compliance status and any regional distribution restrictions prior to procurement. Cross-reference the manufacturer datasheet to validate pinout compatibility and power supply requirements for your specific design implementation.

Soc System On Chip Selection Notes

Select this model when designing systems that require a balance of general-purpose processing and specialized hardware acceleration. Evaluate the available logic resources and AI engine count against your algorithm complexity. Ensure the selected speed grade meets your timing closure requirements for both the programmable logic and embedded processor subsystems.

Soc System On Chip Part Context

This part belongs to the AMD Versal AI Core series, which merges traditional FPGA flexibility with fixed-function AI and DSP engines. The XCVM1302 variant offers a specific density of logic cells and processing units suitable for mid-range adaptive SoC applications. It shares architectural similarities with other Versal devices but differs in resource allocation and performance tiers.

Soc System On Chip Replacement Considerations

Direct replacements within the same family may include the XCVM1802-1LSIVSVD1760 for higher resource counts. Verify pin-to-pin compatibility and software toolchain support before substituting. Consult AMD documentation for detailed migration guides between different Versal density grades.

XCVM1302-1LSIVSVD1760XCVM1302-1LSIVSVD1760
$4,672.88
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