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XCVM1302-2HSINBVB1024 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSALPRIME ACAP FPGA 1024BGA. Review the specifications below when checking this part for your BOM.
The AMD XCVM1302-2HSINBVB1024 is a Versal Premium Adaptive SoC designed for high-performance data center and infrastructure applications. It integrates scalable programmable logic, AI Engines, and hardened processor subsystems on a single die. The device utilizes the HSIN package variant within the BVB series, supporting advanced I/O standards and high-bandwidth memory interfaces required for complex signal processing and network acceleration tasks.
Verify the specific suffix codes against official AMD documentation to confirm package type, temperature range, and industrial qualification status. Ensure supply chain partners provide traceability certificates compliant with aerospace or automotive standards if applicable. Cross-reference the full part number with current AMD product availability lists to confirm manufacturing status and lifecycle stage before finalizing procurement orders.
Select this model when design requirements demand high throughput for vectorized workloads combined with low-latency control processing. Evaluate the available AI Engine tile count and DSP block density against algorithmic complexity. Confirm that the chosen package supports the necessary pin count for target memory controllers and external interface connectivity without excessive routing constraints.
This component belongs to the AMD Versal Premium series, which targets compute-intensive edge and data center nodes. It sits above the Prime series in terms of logic capacity and AI performance, offering a balance between flexibility and integrated acceleration capabilities for next-generation infrastructure platforms requiring significant parallel processing power.
Direct replacements are limited within the same Versal Premium family. Consider the XCVM1802 or XCVM2602 variants for increased resource density. Verify compatibility with existing board layouts and thermal designs when migrating between different package sizes or pin counts within the BVB series.
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