Soc System On Chip XCVM1302-2HSINBVB1024 product image

XCVM1302-2HSINBVB1024

$5,215.81
  • Description:IC VERSALPRIME ACAP FPGA 1024BGA
  • Series:Versal™ Prime

SKU:acad155d5594 Category: Brand:

  
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XCVM1302-2HSINBVB1024 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSALPRIME ACAP FPGA 1024BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCVM1302-2HSINBVB1024

  • Description:IC VERSALPRIME ACAP FPGA 1024BGA
  • Series:Versal™ Prime
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DDR, DMA, PCIe
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:600MHz, 1.4GHz
  • Primary Attributes:Versal™ Prime FPGA, 70k Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:1024-BFBGA
  • Supplier Device Package:1024-BGA (31x31)

Soc System On Chip datasheet and documents for XCVM1302-2HSINBVB1024

XCVM1302-2HSINBVB1024

Soc System On Chip Overview

The AMD XCVM1302-2HSINBVB1024 is a Versal Premium Adaptive SoC designed for high-performance data center and infrastructure applications. It integrates scalable programmable logic, AI Engines, and hardened processor subsystems on a single die. The device utilizes the HSIN package variant within the BVB series, supporting advanced I/O standards and high-bandwidth memory interfaces required for complex signal processing and network acceleration tasks.

Soc System On Chip Feature Summary

  • Integrates heterogeneous computing resources including AI Engines, DSP blocks, and Arm Cortex processors for unified hardware acceleration.
  • Features high-speed serial transceivers capable of supporting modern interconnect protocols such as PCIe Gen5 and high-rate Ethernet.
  • Provides extensive programmable logic fabric to implement custom data paths and protocol offloading engines.

Soc System On Chip Applications

  • Data center network acceleration and virtualization
  • High-frequency trading and financial analytics
  • Advanced radar and electronic warfare signal processing

Soc System On Chip Procurement Notes

Verify the specific suffix codes against official AMD documentation to confirm package type, temperature range, and industrial qualification status. Ensure supply chain partners provide traceability certificates compliant with aerospace or automotive standards if applicable. Cross-reference the full part number with current AMD product availability lists to confirm manufacturing status and lifecycle stage before finalizing procurement orders.

Soc System On Chip Selection Notes

Select this model when design requirements demand high throughput for vectorized workloads combined with low-latency control processing. Evaluate the available AI Engine tile count and DSP block density against algorithmic complexity. Confirm that the chosen package supports the necessary pin count for target memory controllers and external interface connectivity without excessive routing constraints.

Soc System On Chip Part Context

This component belongs to the AMD Versal Premium series, which targets compute-intensive edge and data center nodes. It sits above the Prime series in terms of logic capacity and AI performance, offering a balance between flexibility and integrated acceleration capabilities for next-generation infrastructure platforms requiring significant parallel processing power.

Soc System On Chip Replacement Considerations

Direct replacements are limited within the same Versal Premium family. Consider the XCVM1802 or XCVM2602 variants for increased resource density. Verify compatibility with existing board layouts and thermal designs when migrating between different package sizes or pin counts within the BVB series.

XCVM1302-2HSINBVB1024XCVM1302-2HSINBVB1024
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