XCVM1302-2LLEVSVD1760

Soc System On Chip Overview

The AMD XCVM1302-2LLEVSVD1760 is a Versal Prime Series SoC FPGA manufactured by AMD. It operates within a temperature range of -40°C to +110°C and utilizes an 800 mV core voltage. The component is housed in a 1760-ball FCBGA package, designed for surface-mount technology. As part of the Versal family, it integrates adaptive compute capabilities with high-bandwidth memory interfaces and hardened IP blocks for networking and storage applications.

Soc System On Chip Feature Summary

• Integrates programmable logic with AI Engines and processing systems for heterogeneous computing
• Supports high-speed DDR memory interfaces including LPDDR5 and DDR5
• Features hardened network and storage connectivity cores for low-latency acceleration

Soc System On Chip Applications

• Data center network acceleration
• Storage acceleration
• 5G xHaul infrastructure

Soc System On Chip Procurement Notes

Verify the specific ordering suffix against the official AMD datasheet to confirm package type and temperature grade. Ensure compatibility with the required PCB stack-up for the 1760-ball FCBGA form factor. Confirm availability through authorized distributors as supply levels may vary. Request the latest design files and power estimation tools from AMD for accurate thermal planning.

Soc System On Chip Selection Notes

Select this model when high data throughput and low-latency inline acceleration are required for connected workloads. Compare resource utilization against the Versal Premium series if higher serial bandwidth or specific encryption engines are needed. Verify that the available DSP engine count and AI Engine tile density meet the computational requirements of the target application workload.

Soc System On Chip Part Context

This component belongs to the AMD Versal Prime Series, which targets mid-range markets requiring high bandwidth DDR interfaces and enhanced DSP functionality. It serves as a bridge between standard FPGAs and higher-end Versal Premium devices, offering optimized performance for communication, test equipment, and storage applications without the full cost of premium features.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements are not publicly documented for this specific suffix. Consider the XCVM1502-2MSIVFVC1760 for similar packaging but verify functional differences in resource counts. Consult AMD documentation for migration guides between Versal Prime variants.