XCVM1302-2MLIVFVC1596

Soc System On Chip Overview

The AMD XCVM1302-2MLIVFVC1596 is a Versal Premium Adaptive SoC FPGA featuring a 7nm FinFET process. It integrates 14 AI Engines, 180 DSP slices, and 1.8M logic cells within a 1596-ball FCBGA package. The device includes dual Arm Cortex-A72 cores for application processing and dual Cortex-R5F cores for real-time control. It supports high-speed serial transceivers up to 58 Gb/s and 112 Gb/s PAM4, enabling PCIe Gen5 and 100G Ethernet connectivity.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining programmable logic, AI Engines, and hardened processor subsystems
• Integrated High Bandwidth Memory (HBM) interface for high-throughput data access
• Advanced security features including hardware root of trust and encryption engines

Soc System On Chip Applications

• Data center network acceleration and virtual switching
• High-performance computing and machine learning inference
• Telecommunications infrastructure and 5G xHaul systems

Soc System On Chip Procurement Notes

Verify the specific suffix codes against official AMD documentation to confirm temperature range, packaging type, and delivery tape/reel specifications. Ensure compatibility with required Vivado and Vitis tool versions for the selected speed grade. Confirm supply chain authenticity through authorized distributors to mitigate counterfeit risks.

Soc System On Chip Selection Notes

Select this model based on the requirement for integrated HBM and high-density AI Engines within the Versal Premium family. Compare resource utilization against the XCVP1802 or XCVM1802 if higher logic or DSP counts are needed. Validate that the 1596-ball package fits the target PCB form factor and thermal constraints.

Soc System On Chip Part Context

This component belongs to the AMD Versal Premium series, designed for compute-intensive workloads requiring low latency and high bandwidth. It sits between the Versal Prime and Versal AI Edge series in terms of performance and integration level, targeting enterprise and infrastructure applications.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements may include other XCVM1302 variants with different suffixes for temperature or packaging. For functional upgrades, consider the XCVM1802 for increased resources. Verify backward compatibility with existing board designs when substituting.