XCVM1302-2MLIVSVD1760

Soc System On Chip Overview

The AMD XCVM1302-2MLIVSVD1760 is a Versal Prime Adaptive SoC FPGA in a 1760-ball FCBGA package. It integrates dual-core Arm Cortex-A72 and dual-core Arm Cortex-R5F processors with a maximum clock frequency of 1.4 GHz for the R5F cores. The device operates at a core voltage of 800 mV within a temperature range of -40°C to +110°C. Key resources include 1,312 K system logic cells, 599,040 LUTs, and 648 DSP engines. It features four integrated memory controllers supporting high-bandwidth DDR interfaces.

Soc System On Chip Feature Summary

• Versal Prime architecture optimized for low-latency inline acceleration in data center networking and storage applications
• Heterogeneous computing platform combining scalar processing units with programmable logic and AI engines
• Integrated high-speed serial transceivers supporting advanced network protocols and multi-rate Ethernet

Soc System On Chip Applications

• Data center network acceleration including virtual switching and encryption offload
• Storage acceleration for compression and data management tasks
• 5G xHaul infrastructure supporting eCPRI and legacy standards

Soc System On Chip Procurement Notes

Verify the specific ordering suffix against the official AMD datasheet to confirm package type, temperature grade, and industrial specifications. Ensure compatibility with the Vivado design suite and Vitis software platform for development. Confirm RoHS compliance status through authorized distributors or direct manufacturer channels prior to procurement.

Soc System On Chip Selection Notes

Select this model for workloads requiring high throughput with deterministic latency, such as inline network processing. Compare resource utilization against the Versal AI Core series if heavy vector computation is required. Verify that the available I/O count and transceiver speeds meet the specific interface requirements of the target system design.

Soc System On Chip Part Context

This component belongs to the AMD Versal Prime family, designed specifically for connectivity and inline acceleration. It sits between the standard Versal devices and the high-performance Versal Premium or HBM series, offering a balance of logic density and power efficiency for communication and storage markets.

Soc System On Chip Replacement Considerations

Direct functional replacements within the same package and pinout are limited. Consider the XCVP1402 or XCVM1802 for increased resource density, though these require significant schematic and layout modifications due to different pin configurations and power requirements.