XCVM1302-2MSENBVB1024

Soc System On Chip Overview

The AMD XCVM1302-2MSENBVB1024 is a Versal Premium Adaptive SoC FPGA designed for high-performance data center and infrastructure applications. It features a heterogeneous architecture integrating Application Processing Units (APUs), Real-Time Processing Units (RTPUs), AI Engines, and Programmable Logic (PL). The device supports advanced I/O standards including PCIe Gen5 and 112G PAM4 SerDes, enabling high-bandwidth connectivity. Key specifications include approximately 13,000K system logic units, over 6 million LUTs, and thousands of DSP engines. It incorporates dual-core Arm Cortex-A72 processors for application tasks and dual-core Cortex-R5F for real-time control, housed in a 1024-ball package.

Soc System On Chip Feature Summary

• Heterogeneous computing platform combining scalar processors, AI vector engines, and programmable logic for optimized workload distribution.
• Integrated high-speed I/O supporting PCIe Gen5 and 112G PAM4 transceivers for next-generation network and storage acceleration.
• On-chip memory controllers and hardened IP blocks reduce latency and offload processing from host CPUs.

Soc System On Chip Applications

• Data center network acceleration and virtual switching
• High-throughput storage controllers and NVMe acceleration
• 5G xHaul and wireless infrastructure baseband processing

Soc System On Chip Procurement Notes

Verify the specific suffix codes against official AMD documentation to confirm temperature range, packaging type, and lead time classifications. Ensure compatibility with required power delivery designs and thermal management solutions before procurement. Cross-reference the full part number with current availability lists as supply conditions may vary by region and distributor.

Soc System On Chip Selection Notes

Select this model when design requirements demand high-density programmable logic combined with significant AI and DSP capabilities. Evaluate the balance between PL resources and processor core counts relative to target algorithm complexity. Consider the pinout and package constraints for PCB layout, ensuring sufficient layers for high-speed signal integrity and adequate thermal dissipation paths for the BGA footprint.

Soc System On Chip Part Context

This component belongs to the AMD Versal Premium series, targeting compute-intensive workloads requiring low latency and high bandwidth. It sits above the Prime series in terms of resource density and I/O capabilities, offering enhanced AI Engine performance and more extensive interconnect options suitable for complex system-on-chip implementations in enterprise environments.

Soc System On Chip Replacement Considerations

Direct replacements within the Versal family include other Premium or HBM variants such as the XCVM1802 or XCVM2602 series, depending on required logic density and memory bandwidth. Lower-tier alternatives like the Versal Prime series may suffice if AI and DSP resources are not fully utilized. Verify pin-to-pin compatibility and software toolchain support when considering cross-series migration.