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XCVM1402-1LLINSVF1369 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSALPRIME ACAP FPGA 1369BGA. Review the specifications below when checking this part for your BOM.
The XCVM1402-1LLINSVF1369 is an AMD Xilinx Versal Premium Adaptive SoC FPGA belonging to the XCVM1402 device family. It utilizes a 7nm FinFET process technology and is housed in a 1369-ball FCBGA package. The component integrates heterogeneous computing resources, including AI Engines, programmable logic, and processing systems. Key electrical parameters include a minimum operating temperature of -40°C and a maximum operating temperature of +110°C. The core logic operates at a voltage of 800 mV. This device supports high-bandwidth DDR memory interfaces and advanced SerDes capabilities for data center and infrastructure applications.
Verify the specific ordering suffix against the official AMD datasheet to ensure correct speed grade and package variant. Confirm RoHS compliance status through manufacturer documentation prior to integration. Check for regional distribution restrictions or limited availability notices from authorized suppliers before finalizing procurement plans.
Select this model when requiring high-throughput inline acceleration with integrated AI and DSP capabilities. Ensure PCB design supports the 1369-ball FCBGA form factor and thermal requirements. Validate that the target application benefits from the Versal Prime/Premium hybrid architecture over standard FPGA solutions.
This part belongs to the AMD Versal Premium series, designed for mid-range markets requiring high bandwidth DDR interfaces and 112 Gb/s transceivers. It complements the broader Versal portfolio by offering enhanced DSP features and optimized performance for communication and storage applications compared to previous generations.
Consult the AMD Versal product selection guide for direct pin-to-pin or functional equivalents within the XCVM1402 family. Verify compatibility with existing board layouts and software platforms when considering alternative speed grades or package options.
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