SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
XCVM1402-1LLIVSVD1760 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSALPRIME ACAP FPGA 1760BGA. Review the specifications below when checking this part for your BOM.
The AMD XCVM1402-1LLIVSVD1760 is a Versal Prime adaptive SoC featuring an integrated AI Engine matrix, programmable logic, and ARM processor cores. It operates at a minimum junction temperature of -40°C and a maximum of +110°C with a core voltage of 0.8V. The device utilizes a 1760-ball FineLine iQ FCBGA package to support high-density interconnects for demanding edge and infrastructure applications.
Verify the specific suffix LLIVSVD1760 against official AMD documentation to confirm package type and thermal specifications. Ensure compatibility with required power delivery designs and cooling solutions for the specified operating temperature range before procurement.
Select this model when design requirements prioritize energy efficiency and deterministic performance over raw peak compute throughput. Compare Versal Prime resources against Versal AI Core or AI Edge variants to ensure sufficient logic and AI engine capacity for the target application workload.
This component belongs to the AMD Versal Prime series, which targets cost-sensitive and power-constrained applications requiring adaptive computing. It shares the foundational Versal architecture but focuses on efficient signal processing rather than high-end AI training or massive parallelism found in other series.
Consult AMD cross-reference tools for verified pin-compatible or functionally equivalent alternatives within the Versal family. Verify that any substitute part maintains the same package dimensions and electrical characteristics.
Explore related parts through Embedded, Integrated Circuits (ICs), all product categories, ChipApex homepage.