XCVM1402-1LSENSVF1369

Soc System On Chip Overview

The AMD XCVM1402-1LSENSVF1369 is a Versal Premium Adaptive SoC FPGA designed for high-performance data center and infrastructure applications. It integrates scalable programmable logic, AI vector engines, and hardened processing subsystems on a single die. The device features dual-core Arm Cortex-A72 processors for application execution and dual-core Cortex-R5F processors for real-time control. It includes extensive DSP resources and high-speed serial transceivers supporting advanced interface protocols. The component utilizes a 1369-ball package to facilitate dense system integration while maintaining low latency and high throughput for complex heterogeneous computing workloads.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining programmable logic, AI Engines, and scalar processors for optimized workload distribution
• Integrated hardened IP for high-speed connectivity including PCIe Gen5 and multi-rate Ethernet MACs
• Dual-core Arm Cortex-A72 and Cortex-R5F processing subsystems for flexible OS and real-time control support
• Advanced power management capabilities with dynamic voltage and frequency scaling for energy efficiency

Soc System On Chip Applications

• Data center network acceleration and inline processing
• Storage controller acceleration and endpoint optimization
• 5G xHaul and wireless infrastructure baseband processing
• High-bandwidth signal processing and radar systems

Soc System On Chip Procurement Notes

Verify the specific ordering part number against official AMD documentation to ensure correct suffix alignment for temperature grade and package variant. Confirm availability through authorized AMD distributors or direct enterprise channels. Request latest datasheets and mechanical drawings prior to procurement to validate pinout and thermal specifications for your specific PCB design requirements.

Soc System On Chip Selection Notes

Select this model when requiring a balance of high-end AI vector processing and robust scalar compute within a Versal Premium form factor. Evaluate the specific resource needs for AI Engine tiles versus programmable logic slices to ensure optimal cost-performance ratio. Consider the I/O density and transceiver speeds required for your target interfaces, such as 112G PAM4 or PCIe Gen5, to confirm this device meets bandwidth constraints without over-specifying resources.

Soc System On Chip Part Context

This component belongs to the AMD Versal Premium series, targeting demanding infrastructure and data center markets. It sits alongside other Versal variants like Prime and Edge, offering higher computational density than entry-level models. The XCVM1402 designation indicates specific resource allocation within the Premium tier, distinguishing it from lower-capacity parts in the same family.

Soc System On Chip Replacement Considerations

Direct replacements are limited within the Versal ecosystem due to unique resource configurations. Verify compatibility with XCVM1802 or XCVM1402 variants differing only in suffix codes for package or temperature. Cross-family migration to UltraScale+ requires significant architectural redesign and is not a direct drop-in replacement.