XCVM1402-1MSIVSVD1760

Soc System On Chip Overview

The XCVM1402-1MSIVSVD1760 is an AMD Xilinx Versal Premium Adaptive SoC FPGA. It integrates programmable logic, AI Engines, and a processing system with ARM Cortex-A72 and Cortex-R5F cores. The device operates at a minimum temperature of -40°C and a maximum of +110°C. It utilizes an FCBGA-1760 package for surface mount installation. The core voltage is specified at 800 mV. This component belongs to the Versal family of System-on-Chips designed for high-performance computing applications.

Soc System On Chip Feature Summary

• Versal Premium Adaptive SoC architecture integrating heterogeneous compute resources
• Embedded ARM Cortex-A72 and Cortex-R5F processing subsystems
• High-density FCBGA-1760 package suitable for complex board designs

Soc System On Chip Applications

• Data center acceleration
• Network infrastructure
• Telecommunications systems

Soc System On Chip Procurement Notes

Verify the exact part number against official AMD Xilinx documentation before procurement. Ensure compatibility with required power delivery specifications and thermal management solutions. Confirm that the specific suffix matches the intended speed grade and package variant. Cross-reference with authorized distributors to ensure authenticity and traceability of the semiconductor components.

Soc System On Chip Selection Notes

Select this model based on the requirement for Versal Premium performance within the 1760-ball form factor. Evaluate the specific logic resource and AI Engine requirements against the datasheet specifications. Consider the operating temperature range and voltage requirements for the target environment. Compare with other Versal variants if different I/O counts or performance grades are needed.

Soc System On Chip Part Context

This component is part of the AMD Xilinx Versal Premium series, which targets demanding applications requiring significant adaptive compute capabilities. The Versal platform combines traditional FPGA logic with specialized AI and processing engines. The 1760-ball package offers a balance between pin count and physical footprint for mid-to-high-end deployments.