XCVM1402-2HSINSVF1369

Soc System On Chip Overview

The AMD XCVM1402-2HSINSVF1369 is a Versal Premium Adaptive SoC FPGA from the AMD/Xilinx portfolio. It integrates programmable logic, AI Engines, and processing systems on a single chip. The device utilizes an FCBGA-1369 package for surface mount installation. It supports high-speed serial transceivers for data center and networking applications. The component operates within standard industrial temperature ranges. It combines heterogeneous computing capabilities with flexible I/O interfaces.

Soc System On Chip Feature Summary

• Heterogeneous architecture integrating AI Engines, programmable logic, and processing subsystems
• High-bandwidth NoC interconnect for efficient data movement between compute tiles
• Support for hardened IP blocks including PCIe and Ethernet controllers
• Advanced security features with hardware root of trust

Soc System On Chip Applications

• Data center acceleration and cloud infrastructure
• 5G network baseband processing
• High-performance computing systems
• Enterprise storage controllers

Soc System On Chip Procurement Notes

Verify the exact ordering suffix to ensure correct speed grade and package variant. Confirm RoHS compliance status through official manufacturer documentation before integration. Check for any specific environmental certifications required by your target market regulations. Ensure supply chain authenticity through authorized distribution channels only.

Soc System On Chip Selection Notes

Compare resource requirements against other Versal models like XCVC or XCVP series. Evaluate power consumption profiles using Power Design Manager tools. Assess thermal management needs based on the specific application load. Verify pin compatibility if replacing legacy Xilinx devices in existing designs.

Soc System On Chip Part Context

This part belongs to the Versal Premium family, designed for high-end adaptive computing. It sits above entry-level Versal models in terms of AI Engine count and logic resources. The 1369-ball package offers a balance of I/O density and board space efficiency compared to larger form factors.

Soc System On Chip Replacement Considerations

Direct replacements are limited within the same speed grade and package. Consider XCVM1402 variants with different suffixes for minor feature changes. Cross-family migration to XCVP may require significant design rework due to architectural differences.