XCVM1402-2MSINBVB1024

Soc System On Chip Overview

The AMD XCVM1402-2MSINBVB1024 is a Versal Premium Adaptive SoC FPGA designed for high-performance data center and infrastructure applications. It integrates scalable programmable logic, AI Vector Engines, and hardened Arm processor subsystems on a single die. The device supports advanced I/O standards including PCIe Gen5 and high-speed Ethernet, enabling low-latency inline acceleration. Key specifications include approximately 6.3 million system logic cells, over 12,000 DSP engines, and dual-core Arm Cortex-A72 processors alongside dual-core Cortex-R5F real-time cores. It utilizes a 1024-ball FCBGA package to deliver dense integration for complex signal processing and networking workloads.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining programmable logic, AI vector engines, and hardened Arm processors for optimized workload distribution
• Integrated high-bandwidth DDR memory controllers supporting next-generation memory interfaces for reduced system latency
• Advanced serial transceivers capable of multi-rate speeds to support PCIe Gen5 and high-throughput Ethernet protocols

Soc System On Chip Applications

• Data center network acceleration and virtual switching
• High-performance storage controllers with inline compression offload
• 5G xHaul infrastructure and radio access networks
• Radar and advanced signal processing systems

Soc System On Chip Procurement Notes

Verify the specific ordering part number against official AMD documentation to ensure correct speed grade and package variant. Confirm that the required Vivado and Vitis tool versions are compatible with the Versal Premium series. Check for any specific environmental or reliability certifications required for your target deployment environment before finalizing procurement.

Soc System On Chip Selection Notes

Select this component when design requirements demand significant parallel processing capabilities combined with deterministic control via Arm cores. Evaluate the available AI Engine resources against expected matrix operation loads. Ensure PCB layout capabilities support the high-density BGA package and that thermal management solutions can handle the power dissipation profile of the premium tier device.

Soc System On Chip Part Context

This model belongs to the AMD Versal Premium series, positioned above the Prime series in terms of logic density and AI engine capacity. It targets applications requiring substantial heterogeneous computing resources within a single chip. The Versal platform represents a shift towards adaptive compute architectures that blend FPGA flexibility with ASIC-like performance for specific accelerators.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements may not exist due to the unique Versal architecture. Consider other Versal models such as the XCVP1802 or XCVM2602 if resource scaling is needed. Verify compatibility with existing board designs and software drivers when migrating between different Versal tiers.