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XCVM1502-2MLENFVB1369 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSALPRIME ACAP FPGA 1369BGA. Review the specifications below when checking this part for your BOM.
The AMD XCVM1502-2MLENFVB1369 is a Versal Prime Adaptive SoC featuring integrated ARM Cortex-A72 and Cortex-R5F processors. It utilizes a 1369-ball VFVC1760 flip-chip package. The device supports dual quad serial NOR flash memories and accommodates single, dual-stacked, or dual-parallel configurations in both addressing modes. Designed for demanding embedded applications, it operates within a temperature range of 0°C to 110°C and complies with RoHS3 standards.
Verify the complete part number against official AMD documentation to ensure correct suffix alignment. Confirm that the specific ordering suffix matches the required package and temperature grade. Cross-reference the datasheet for any recent revisions affecting pinout or electrical specifications before finalizing procurement decisions.
Select this component when integrating Versal Prime architecture is required for complex embedded tasks. Consider its support for multiple memory configurations and high operating temperatures. Evaluate compatibility with existing system designs regarding the 1369-ball flip-chip footprint and thermal management requirements.
This model belongs to the AMD Versal Prime series, combining processing cores with programmable logic. It targets applications needing adaptive compute capabilities alongside standard processor functions. The device represents a System on Chip solution designed for flexibility in demanding environments.
Official substitutes include XCVM1502-2MSINFVB1369 and XCVM1502-2LLEVFVC1760. Verify package compatibility and functional equivalence before substitution.
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