Soc System On Chip XCVM1802-1LSEVSVD1760 product image

XCVM1802-1LSEVSVD1760

$9,041.88
  • Description:IC VERSAL AICORE FPGA 1760BGA
  • Series:Versal™ Prime

SKU:098694847ce0 Category: Brand:

  
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XCVM1802-1LSEVSVD1760 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSAL AICORE FPGA 1760BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCVM1802-1LSEVSVD1760

  • Description:IC VERSAL AICORE FPGA 1760BGA
  • Series:Versal™ Prime
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DDR, DMA, PCIe
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:400MHz, 1GHz
  • Primary Attributes:Versal™ Prime FPGA, 1.9M Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:1760-BFBGA, FCBGA
  • Supplier Device Package:1760-FCBGA (40x40)

Soc System On Chip datasheet and documents for XCVM1802-1LSEVSVD1760

XCVM1802-1LSEVSVD1760

Soc System On Chip Overview

The AMD XCVM1802-1LSEVSVD1760 is a Versal Prime Series Adaptive SoC housed in a 1760-ball FCBGA package. It integrates dual-core Arm Cortex-A72 and dual-core Arm Cortex-R5F processors with maximum clock frequencies of 600 MHz and 1.4 GHz, respectively. The device features 1,968 K system logic cells, 899,840 LUTs, and 1,968 DSP engines. It operates at a core voltage of 800 mV within a commercial temperature range of 0°C to 100°C TJ.

Soc System On Chip Feature Summary

  • Versal Prime Series adaptive SoC architecture
  • Integrated dual-core Arm Cortex-A72 and Cortex-R5F processing subsystems
  • High-density programmable logic with extensive DSP capabilities
  • Support for PCIe Gen4 and high-speed optical interfaces

Soc System On Chip Applications

  • Data center network acceleration
  • SmartNIC implementations
  • 5G xHaul infrastructure
  • Nx100G Ethernet networking

Soc System On Chip Procurement Notes

Verify the specific suffix '1LSEVSVD1760' against official AMD documentation to confirm availability and exact specifications. Suffix variations often indicate differences in speed grades, packaging, or environmental ratings. Consult authorized distributors for current supply status and lead times, as Versal devices are typically built-to-order.

Soc System On Chip Selection Notes

Select this model for applications requiring mid-range Versal performance with a compact 1760-pin footprint. Ensure PCB design supports the required 800 mV core voltage and thermal dissipation for the FCBGA package. Verify that the 1.9M logic cell count and DSP resources meet the specific algorithmic throughput requirements of the target workload.

Soc System On Chip Part Context

This component belongs to the AMD Versal Prime Series, designed for cost-effective acceleration in data center and communications markets. It shares architectural similarities with other VM1802 variants but differs in package size (1760 vs 2197 balls) and potentially speed grade, offering a balance of compute density and I/O connectivity for embedded and networking systems.

Soc System On Chip Replacement Considerations

Direct replacements include other XCVM1802 variants such as XCVM1802-2LSEVSVA2197 or XCVM1802-2MSEVSVD1760. Substitution requires verification of pin compatibility, package dimensions, and electrical characteristics. Speed grades and feature sets may vary between suffixes; consult the Versal Product Selection Guide for detailed comparisons.

XCVM1802-1LSEVSVD1760XCVM1802-1LSEVSVD1760
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