XCVM1802-1MLIVFVC1760

Soc System On Chip Overview

The XCVM1802-1MLIVFVC1760 is an AMD Versal Premium Series Adaptive SoC designed for high-performance computing and networking applications. It integrates a software-programmable silicon infrastructure with specialized compute engines, including AI Engines and DSPs, alongside dual-core Arm Cortex-A72 application processors and dual-core Cortex-R5F real-time processors. The device features extensive connectivity options such as PCIe Gen4, SFP28, QSFP28, and RJ-45 Ethernet interfaces. It operates within a temperature range of -40°C to +110°C and utilizes an 800 mV core voltage. The component is housed in a 1760-ball package suitable for complex system-on-module implementations.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining programmable logic, AI Engines, DSPs, and scalar processors for optimized workload acceleration
• Integrated high-speed serial transceivers supporting multiple networking protocols and data rates
• Programmable Network on Chip (NoC) providing flexible and scalable on-chip interconnectivity
• Comprehensive I/O support including PCIe Gen4, optical interfaces, and standard Ethernet ports

Soc System On Chip Applications

• Data center network and storage acceleration
• SmartNIC and 5G xHaul infrastructure
• Nx100G Ethernet and OTN networking equipment
• Communications test and measurement systems

Soc System On Chip Procurement Notes

Verify availability status directly with authorized distributors or the manufacturer, as supply constraints may apply. Confirm that the specific ordering suffix matches the required package and temperature grade. Ensure compliance with RoHS directives and other relevant environmental regulations before procurement. Request official datasheets and errata sheets to validate technical specifications against current production revisions.

Soc System On Chip Selection Notes

Select this model when requiring a balance of high-density logic resources and dedicated AI/DSP compute capabilities without the integrated HBM memory found in the Versal HBM series. Evaluate the available System Logic Cells and LUT count against target algorithm complexity. Consider the number of available GT transceers for interface requirements. Compare power consumption estimates using AMD Power Design Manager tools to ensure thermal management feasibility within the target enclosure design.

Soc System On Chip Part Context

This part belongs to the AMD Versal Premium series, which targets mid-to-high-end adaptive computing needs. It sits below the Versal HBM series in terms of memory integration but offers significant flexibility through its programmable fabric. The XCVM1802 variant provides a specific resource density suitable for demanding networking and compute tasks where custom hardware acceleration is necessary alongside general-purpose processing.

Soc System On Chip Replacement Considerations

Direct replacements within the same family include the XCVM1802-2MSEVSVA2197, often featured in evaluation kits like the VMK180. Verify pinout compatibility and resource equivalence between variants. Cross-reference with the XCVP1402 or XCVP1802 series if HBM integration is not required but different I/O counts are needed. Always consult the latest AMD migration guides for architectural differences.