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XCVM1802-1MSIVSVA2197 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSAL AICORE FPGA 2197BGA. Review the specifications below when checking this part for your BOM.
The XCVM1802-1MSIVSVA2197 is a Versal Prime Series SoC FPGA manufactured by AMD. It features an FCBGA-2197 package with 770 I/O pins and operates within a junction temperature range of 0°C to 100°C. The processing system includes dual-core ARM Cortex-A72 cores running at up to 600 MHz and dual-core ARM Cortex-R5F cores operating at up to 1.3 GHz. L1 cache configurations consist of 48 kB instruction and 32 kB data memory per core type. The device integrates 1,968 K logic units, DDR controllers, DMA, PCIe peripherals, and supports interfaces including Ethernet, SPI, UART, and USB OTG.
Verify the exact suffix against official AMD documentation, as variations exist within the XCVM1802 family. Confirm availability through authorized distributors, as stock levels are often restricted. Ensure compliance with RoHS standards and moisture sensitivity level requirements during handling and assembly processes.
Select this component when high-bandwidth DDR memory interfaces and low-latency acceleration are required. The Versal Prime series is optimized for inline acceleration in communication and measurement testing markets. Evaluate the specific speed grade (-1M) to ensure it meets the target clock frequency requirements for both A72 and R5F cores.
This part belongs to the AMD Versal Prime series, designed for mid-range applications requiring high data throughput. It shares architectural similarities with other VM1802 variants but differs in speed grading and specific feature enablement. The series targets markets needing efficient processing of high-volume data streams without the full complexity of higher-tier Versal AI Core devices.
Direct substitutes include other XCVM1802 variants such as XCVM1802-1LSEVSVA2197 or XCVM1802-2MSEVSVA2197, depending on required performance grades. Verify pin compatibility and thermal specifications before substitution.
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