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XCVU3P-L2FFVC1517E is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 520 I/O 1517FCBGA. Review the specifications below when checking this part for your BOM.
The XCVU3P-L2FFVC1517E is a Virtex UltraScale+ Field Programmable Gate Array manufactured by AMD. It features 862,050 logic elements and 49,260 Adaptive Logic Modules within an FBGA-1517 package. The device includes 25.3 Mbit of embedded memory and supports up to 560 I/Os. It operates at a core voltage of 850 mV with a maximum data rate of 32.75 Gb/s across 40 transceivers. The industrial temperature range spans from 0°C to +110°C.
Verify export compliance requirements before ordering, as this product may require additional documentation for shipment from the United States. Confirm that the specific L2 speed grade and FFVC1517 package variant match the design specifications. Ensure thermal management solutions are adequate for the operating temperature range of 0°C to +110°C.
Select this model when designs require approximately 862K logic cells and 40 high-speed GTY transceivers. Compare against the -I suffix variant if a wider commercial temperature range (-40°C to +100°C) is acceptable. Verify that the 1517-pin BGA footprint fits the PCB layout constraints.
This component belongs to the AMD Virtex UltraScale+ family, designed for high-end performance and integration. It utilizes 16 nm FinFET technology to deliver high bandwidth and signal processing capabilities. The series is known for long-term availability and reliability in critical infrastructure applications.
The XCVU3P-2FFVC1517I offers similar logic density but differs in temperature rating and speed grade. Cross-referencing pinouts and electrical characteristics is essential when substituting models within the same package family.
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