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XCZU11EG-2FFVF1517I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC SOC CORTEX-A53 1517FCBGA. Review the specifications below when checking this part for your BOM.
The AMD XCZU11EG-2FFVF1517I is a Zynq UltraScale+ MPSoC EG device built on 16nm FinFET+ technology. It integrates a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and Mali-400 MP2 GPU. The programmable logic fabric provides 653,100 logic elements, 21.1 Mbit embedded memory, and 48 high-speed transceivers. Operating in the industrial temperature range of -40°C to +100°C, it utilizes an FCBGA-1517 package with 496 I/Os.
Verify the specific suffix '2' indicates the performance bin or speed grade against official AMD documentation. Confirm RoHS compliance status and moisture sensitivity level (MSL) requirements for surface-mount assembly. Ensure supply chain authorization through AMD-approved distributors to guarantee component authenticity and traceability.
Select this model when high-end multimedia processing and deterministic real-time control are required within a single chip. Compare against the CG variant if GPU acceleration is unnecessary, or the EV variant if dedicated video codec hardware is prioritized over general-purpose GPU compute. Validate that the 1517-ball package fits the board layout constraints.
This component belongs to the Zynq UltraScale+ MPSoC EG series, designed for high-performance adaptive SoC applications. It sits above the CG (dual-core) and EV (video-focused) variants in terms of general-purpose processing power and graphics capability, targeting demanding embedded systems.
Direct pin-to-pin replacements within the same package are limited to other XCZU11EG variants with compatible ball counts. Cross-series migration to Zynq-7000 requires significant architectural redesign due to differences in processor cores and FPGA fabric architecture.
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