XCZU11EG-3FFVC1760E

Soc System On Chip Overview

The XCZU11EG-3FFVC1760E is a Zynq UltraScale+ MPSoC EG device manufactured by AMD. It integrates a quad-core ARM Cortex-A53 MPCore application processor, a dual-core ARM Cortex-R5F real-time processor, and an ARM Mali-400 MP2 GPU. The programmable logic section contains over 653K logic cells. Key electrical parameters include processing system speeds up to 1.5 GHz, real-time processor speeds up to 600 MHz, and GPU frequencies up to 667 MHz. The device operates within a junction temperature range of 0°C to 100°C and utilizes a 1517-ball FCBGA package.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining quad-core ARM Cortex-A53, dual-core ARM Cortex-R5F, and Mali-400 MP2 GPU
• Programmable logic with 653K+ logic cells for custom hardware acceleration
• Support for high-speed peripherals including PCIe Gen2, USB 3.1, SATA 3.0, and Gigabit Ethernet
• Dynamic memory interface compatibility with DDR4, LPDDR4, DDR3, and LPDDR3 standards

Soc System On Chip Applications

• Industrial IoT gateways requiring mixed critical and non-critical processing
• Automotive ADAS systems utilizing the Cortex-R5F for safety functions
• Video processing endpoints leveraging the Mali-400 MP2 GPU
• High-performance embedded computing platforms

Soc System On Chip Procurement Notes

Verify the specific speed grade suffix '3' against the official AMD datasheet to confirm maximum clock frequencies for the PS and PL sections. Ensure the 'E' suffix denotes the extended industrial temperature range as specified in the component documentation. Confirm package dimensions match the 1517-FCBGA specification before integration into PCB designs.

Soc System On Chip Selection Notes

Select this model when both high-throughput application processing and deterministic real-time control are required on a single die. The EG variant specifically includes the Mali-400 MP2 GPU, distinguishing it from CG or EV variants. Verify that the 653K logic cell count meets the FPGA resource requirements for the target design complexity.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ MPSoC EG family, which targets applications needing integrated graphics and high-performance computing. It succeeds earlier Zynq SoC generations by offering FinFET-based programmable logic and enhanced processing system capabilities. The FFVC1760 package provides a dense interconnect solution for complex I/O requirements.

Soc System On Chip Replacement Considerations

Cross-model compatibility exists within the FFVC1760 package family, such as the XCZU9EG or XCZU15EG. However, pin assignments for I/O banks and transceivers may differ between devices. Migration requires verification of bank configurations and transceiver channel availability in the official package pinout documentation.