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XCZU15EG-2FFVB1156E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC SOC CORTEX-A53 1156FCBGA. Review the specifications below when checking this part for your BOM.
The XCZU15EG-2FFVB1156E is a Zynq UltraScale+ MPSoC EG series device manufactured by AMD. It integrates a quad-core Arm Cortex-A53 application processor, dual-core Arm Cortex-R5F real-time processor, and an Arm Mali-400 MP2 GPU with programmable logic containing over 747K logic cells. Fabricated on a 16nm FinFET+ process, the chip utilizes a 1156-pin FCBGA package measuring 35x35mm. The device supports operating junction temperatures from 0°C to 100°C and includes 256KB of on-chip RAM.
Verify availability status as supply may be restricted. Confirm the specific suffix 'E' corresponds to the required temperature range and performance grade against official datasheets before ordering. Ensure compatibility with existing board designs regarding the 1156-FCBGA footprint and voltage requirements.
Select this model for applications requiring high-density FPGA resources alongside powerful ARM processing. The EG variant specifically includes the Mali-400 MP2 GPU for graphics acceleration. Compare logic cell counts and transceiver speeds against lower-tier models if resource utilization is low, or consider higher speed grades if timing closure is challenging at target frequencies.
This component belongs to the Zynq UltraScale+ MPSoC EG family, designed for complex heterogeneous computing. It succeeds earlier Zynq SoC generations by offering greater integration of ARM cores and FPGA fabric on a single die. The EG series distinguishes itself by including a GPU, catering to multimedia and display-intensive applications within industrial and communications sectors.
Direct pin-compatible replacements within the same package are limited. Evaluate other XCZU15EG variants with different speed grades or temperature ranges. Cross-family migration to larger devices like the XCZU19EG requires significant PCB and design adjustments due to package and resource differences.
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