XCZU17EG-1FFVD1760I

Soc System On Chip Overview

The XCZU17EG-1FFVD1760I is an AMD Zynq UltraScale+ MPSoC EG series device featuring a 1760-pin FCBGA package. It integrates a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5 real-time processor, and Mali-400 MP2 GPU. The FPGA fabric provides approximately 926K logic elements and 28 Mbit of embedded memory. Key interfaces include PCIe Gen2, USB 3.1, SATA 3.0, DisplayPort, and Gigabit Ethernet. Operating temperatures range from 0°C to +100°C.

Soc System On Chip Feature Summary

• Heterogeneous SoC architecture with ARM Cortex-A53, Cortex-R5, and Mali-400 MP2 cores
• High-performance FPGA fabric with ~926K logic elements and 28 Mbit embedded memory
• Integrated high-speed peripherals including PCIe Gen2, USB 3.1, and SATA 3.0
• 1760-ball FCBGA package optimized for dense board layouts

Soc System On Chip Applications

• Industrial automation and control systems
• Medical imaging equipment
• Test and measurement instrumentation
• Automotive infotainment and cockpit displays

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature rating (0°C to +100°C) against the official datasheet. Confirm export compliance requirements as this product may require additional documentation for shipment from the United States. Ensure the FFVD1760 pinout matches the target PCB design constraints.

Soc System On Chip Selection Notes

Select this model when a balance of processing power and FPGA flexibility is required in a 1760-pin form factor. Compare against the XCZU19EG variant if higher logic density or memory capacity is needed. Verify that the 1.5 GHz maximum clock frequency for the A53 cores meets the system timing requirements.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ MPSoC EG family, designed for embedded applications requiring long-term availability. It sits between the lower-density ZU7EG/ZU9EG and higher-density ZU15EG/ZU19EG models in terms of FPGA resource count.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package are limited to other XCZU17EG variants with different speed grades or temperature ranges (e.g., XCZU17EG-2FFVD1760E). Cross-family migration requires schematic and layout redesign.